Archive - August 2021

Wi-Fi 6 front end module is optimised for IEEE 802.11ax systems

06-08-2021 | Mouser Electronics | Subs & Systems

New DDR5 industrial grade modules have enhanced endurance and stability

10-08-2021 | Smart Modular Technologies | Semiconductors

Commercial inductor offers high-temperature operation in 7575 case size

10-08-2021 | Vishay | Passives

New smooth-top slim case for mobile electronics

10-08-2021 | OKW Enclosures | Subs & Systems

New chip inductor series offers a high Q value in a miniature size

10-08-2021 | Bourns | Passives

Low-capacitance ESD protection array for high-speed data and audio interfaces

10-08-2021 | New Yorker Electronics | Power

Development environment available to Linux developers

10-08-2021 | Segger | Design & Manufacture

Highest luminance at the smallest size

10-08-2021 | RS Components | Lighting Technologies

Development kit deal for use in Edge IoT applications and more

10-08-2021 | Mouser Electronics | Development Boards

SiC Schottky barrier diodes offer faster switching and higher efficiency

12-08-2021 | Littelfuse | Semiconductors

New MEMS vacuum transducer evaluation kit

12-08-2021 | Posifa Technologies | Design & Manufacture

Accelerated automotive OTA development with an SDK

12-08-2021 | eSync Alliance | Automotive & Transport

Spread spectrum oscillators for reducing EMI emissions

12-08-2021 | Saelig | Passives

New multiplexer module supports MIL-STD-1553 testing

12-08-2021 | Pickering | Subs & Systems

New low-density FPGAs and FPGA SoCs consume half the power of alternatives

12-08-2021 | Microchip Technology | Semiconductors

Modular high-power system ideal for a wide range of applications

12-08-2021 | TTI Europe | Power