Renesas Electronics Corporation has introduced the RA8P1 MCU group, targeting AI and ML applications, as well as real-time analytics. The new MCUs set a new performance benchmark for MCUs by combining a 1GHz Arm Cortex-M85 and a 250MHz Cort

Renesas | 11-07-2025

Würth Elektronik and Nexperia have produced the NEVB-MTR1-KIT1 modular motor driver evaluation kit. The kit, created in collaboration, can be configured for use in under two minutes and is conveniently powered via USB-C. Thanks to the open

Wurth | 11-07-2025

Taoglas has released the Patriot series, a compact, multi-function combination roof-mount antenna designed for connected vehicle fleets across emergency services, utilities, and commercial sectors. Integrating up to 18 antenna elements in a

Taoglas | 11-07-2025

LEM has released a new series of DC meters. The introduction of the DCES600 and DCES1500 enables DC charging infrastructure manufacturers to accelerate time-to-market for fast and megawatt charging solutions, with kWh billing services. The

LEM | 10-07-2025

Nexperia has introduced the industry’s first ESD diodes designed to protect 48V automotive data communications networks against the destructive effects of ESD events. This new portfolio of six robust AEC-Q101 qualified devices covers the re

Nexperia | 10-07-2025

Vishay Intertechnology, Inc. has introduced a new AEC-Q200 qualified NTC immersion thermistor. Featuring a miniature design with a compact sensor tip and thin insulated wire, the Vishay BCcomponents NTCAIMM66H is ideal for the small spaces

Vishay Intertechnology | 10-07-2025

Mouser Electronics, Inc. now offers the new FCMA62N Wi-Fi 6/Bluetooth 5.3 modules from Quectel. The modules provide an ultra-compact LCC form factor (38.3mm × 21.6mm × 4.75mm), with multiple low-power consumption modes and custom features t

Mouser Electronics | 09-07-2025

Amphenol RF has introduced SMA straight plug to straight plug cable assemblies into its extensive interconnect portfolio. These robust jumpers are designed on industry-standard TFC 302LL cable, which offers a low-loss solution for new desig

Amphenol | 08-07-2025

Xsens has launched the Xsens Avior, a lightweight, OEM form factor IMU with a compact 36.8mm x 40mm footprint, which provides enhanced performance in a wide variety of industrial and commercial applications. The device is ideal for high-

Xsens | 07-07-2025

Murata Manufacturing Co., Ltd. announced that the new GCM21BE71H106KE02 MLCC has entered mass production. The device is the world's first 0805-inch size (2mm x 1.25mm) MLCC to provide a capacitance of 10µF with a 50VDC rating and is specifi

Murata | 07-07-2025

Renesas Electronics Corporation has introduced three new high-voltage 650V GaN FETs for AI data centres and server power supply systems, including the new 800V HVDC architecture, e-mobility charging, UPS battery backup devices, battery ener

Renesas | 04-07-2025

FORTEC United Kingdom has introduced the COM-MTHC6, a high-performance COM Express Type 6 Compact module developed to meet the rigorous demands of embedded computing in transportation and defence environments. Combining cutting-edge process

FORTEC United Kingdom | 04-07-2025

ESPEC has released a new thermal cycle chamber capable of delivering a controlled specimen temperature ramp rate of 20K/min, developed to satisfy the growing demands of international standards for semiconductor and electronics reliability t

Unitemp | 04-07-2025

Virtium Embedded Artists has launched the iMX8M Mini DX-M1, a SoM which integrates a quad-core application processor and a 25 TOPS AI hardware accelerator chip with associated memory on a board with a compact 82mm x 50mm footprint. By in

Virtium Embedded Artists | 03-07-2025