BittWare, a Molex company, has announced an early access program to jumpstart the development and integration of embedded systems employing the company's new 3U VPX cards powered by next-generation AMD Ryzen Embedded processors, AMD Versal

BittWare | 22-08-2025

Molex has introduced the AirBorn 3U VPX Power Supply, delivering clean power in a smaller form factor to unlock capacity in space-constrained aerospace, defence and commercial applications. As the latest innovation from AirBorn, a Molex Com

AirBorn | 22-08-2025

Intelliconnect (Europe) will be exhibiting at the European Microwave Week (EuMW 2025), which will be held in Utrecht, the Netherlands, continuing the annual series of highly successful microwave events that started in 1998. The company will

Intelliconnect | 20-08-2025

ODU Connectors will be back at DSEI 2025, unveiling a new era of rugged high-performance connectors for mil/aero systems, optimised for demanding applications. The company offers high-speed data transmission with up to 70% less weight. E

ODU Connectors | 20-08-2025

TT Electronics will be exhibiting advanced power conversion, control, and complex electronics solutions at DSEI in September 2025. At the show, the company will demonstrate how its customised engineering solutions manage the evolving tec

TT Electronics | 20-08-2025

Advantech has launched the ROCK-301, a fanless embedded computer tailored for mission-critical applications. Designed to satisfy the stringent demands of industries such as outdoor operations, in-vehicle systems, defence, and heavy industry

Advantech | 19-08-2025

Alif Semiconductor has released benchmarks on its latest E4, E6 and E8 MCUs and fusion processors, extending Alif's advantage in the AI MCU market. The company has been a trendsetter in this field since 2021, when it introduced its NPU-e

Alif Semiconductor | 15-08-2025

Amphenol RF has introduced a new high-performance surface-mount straight SMB jack into its wide portfolio of SMB connectors. With a true surface-mount footprint, this connector is created with four gold-plated ground tabs that solder direct

Amphenol | 14-08-2025

Concurrent has revealed Apollo, a compact, rugged edge computing system engineered to satisfy the evolving needs of modern defence operations. Built to house a conduction-cooled SOSA-aligned processor board with mission-centric I/O, it deli

Concurrent | 14-08-2025

Teledyne e2v has announced the immediate availability of Engineering Models for its new 16GB radiation-tolerant DDR4 memory. This high-density addition extends its space-grade DDR4 portfolio – already the most deployed in the industry – wit

Teledyne e2v | 12-08-2025

Samtec, Inc. provides development and evaluation kits to ensure and validate that its interconnect products fulfil customers' performance needs. This includes mil/aero applications and utilising COTS and open standards products. The comp

Samtec | 11-08-2025

Anritsu Corporation revealed a notable enhancement to its MT8000A Radio Communication Test Station, expanding the platform's 5G device measurement capabilities to include support for 5G NR NTN (Non-Terrestrial Network) devices. This advance

Anritsu | 08-08-2025

Cinch Connectivity Solutions, a Bel group company, has announced a major advancement for engineering teams working in the rapidly evolving satellite market. With testing and prototyping timelines tightening, the new Qualified Parts for Spac

Cinch | 05-08-2025

Cincoze’s MXM GPU computer series (GM-1100) offers high performance, a compact design, and expansion flexibility, making it an excellent choice for space-constrained Edge AI applications. The series supports the latest 14th Gen Intel Core p

Cincoze | 29-07-2025