Archive - November 2019

Small power relay series office and industrial electronic device

22-11-2019 | TTI Europe | Power

New low-temperature alloy technology offers high-performance and high-reliability

25-11-2019 | Indium Corporation | Subs & Systems

New automatic flip-chip bonder dedicated to device production

25-11-2019 | SET | Subs & Systems

Next-generation automotive radar chips enabled with new high-precision test chamber

25-11-2019 | Rohde & Schwarz | Automotive & Transport

Next-generation Ethernet enables ultra-high-speed between applications

25-11-2019 | Renesas | Automotive & Transport

Brushless motor driver ICs provide energy savings for many applications

25-11-2019 | Mouser Electronics | Semiconductors

EVM enables easy evaluation of retimer

25-11-2019 | Texas Instruments | Design & Manufacture

Heatsinks ideal for DC-DC converter applications

25-11-2019 | RS Components | Subs & Systems

Synchronous boost controllers enable high power boost applications

25-11-2019 | Analog Devices | Power

Ultra-reliable and low-latency wireless M2M communications solution

26-11-2019 | Arrow | Subs & Systems

LED driver with input over voltage protection for challenging power conditions

26-11-2019 | Intertronics | Lighting Technologies

Series of international transformers now UL recognised as Class 2 models

26-11-2019 | Signal Transformer | Power

Underfill epoxy offers thermal conductivity and electrical insulation

26-11-2019 | Masterbond | Subs & Systems

Translating transceivers match up well with low voltage MCUs and FPGAs

26-11-2019 | Mouser Electronics | Subs & Systems

Next generation connectors for inline applications

26-11-2019 | TTI Europe | Connectors, Switches & EMECH

High-accuracy overvoltage reset IC offered in small six-pin package

26-11-2019 | Texas Instruments | Semiconductors