Thermally conductive structural epoxy meets NASA low outgassing specifications

Master Bond Supreme 11AOHTLP is a two-component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since

Test & Measurement | 15-07-2024

Two part structural epoxy meets ISO 10993-5 for non-cytotoxicity

Master Bond Supreme 11AOHTMed is a two-component epoxy providing thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity a

Industrial | 12-02-2024

Thixotropic system offers single component dual cure epoxy

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that provides UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a U

Test & Measurement | 05-12-2023

Thermally conductive and electrically insulative epoxy for medical devices

Master Bond EP40TCMed is a two-part, room-temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically

Medical | 15-08-2023

One-part toughened epoxy for dam-and-fill encapsulation

Master Bond Supreme 3DM-85 is a no-mix, non-solvent-based, one-component epoxy. This thixotropic paste material was formulated as the damming compound in dam-and-fill encapsulation

Industrial | 24-07-2023

Die attach epoxy meets NASA low outgassing requirements

The Master Bond EP17HTDA-2 is a one-component epoxy that may be employed for bonding, sealing and die attachment. It is not premixed and frozen, and it cures with heat. This dimens

Industrial | 25-04-2023

Non-cytotoxic epoxy withstands multiple methods of medical sterilisation

Master Bond EP41S-5Med is a two-part epoxy system that meets the demands of ISO 10993-5 for non-cytotoxicity and can be employed for sealing, bonding, and coating in medical device

Industrial | 13-02-2023

Toughened non-drip epoxy fulfils NASA low outgassing specifications

Master Bond EP40ND is a two-component epoxy system created for bonding, sealing and coating applications. It is a non-drip, toughened system with a simple-to-use 1:1 mix ratio by w

Subs & Systems | 02-08-2022

Silver-filled and low outgassing epoxy for EMI/RFI shielding

The Master Bond EP4S-80 is a one-component silver-filled epoxy that meets NASA low outgassing requirements. It offers an unlimited working life at room temperature, and a moderate

Subs & Systems | 10-01-2022

Graphite filled epoxy features electrical and thermal conductivity

Master Bond EP5G-80 is a one-component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80C for four hours. This graphite filled compound is not pr

Subs & Systems | 01-09-2021

Highly thermally conductive and NASA low outgassing silver filled epoxy

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an excellent thermal conductivity of 16-17W/(m·K). It cures swiftly at temperatures of around 250-300F (~

Subs & Systems | 22-07-2021

Silicone adhesive features high thermal conductivity and electrical insulation

Master Bond MasterSil 153AO is an addition-cured two-part silicone with a self-priming property. It provides a high tensile lap shear strength, especially for a silicone. The syste

Subs & Systems | 19-04-2021

Nanosilica-filled and electrically insulative epoxy offers abrasion resistance

Master Bond EP21NS is a two-part epoxy employed for bonding, sealing, coating and potting/encapsulating. It includes a nanosilica filler that imparts dimensional stability and abra

Subs & Systems | 11-01-2021

Highly flexible UV curable adhesive meets ISO 10993-5 standard for cytotoxicity

Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive featuring optical clarity and abrasion resistance. Not only can it be employed for bonding, but it can also be us

Subs & Systems | 30-11-2020