New low-temperature alloy technology offers high-performance and high-reliability

25-11-2019 | Indium Corporation | Subs & Systems

The Indium Corporation Durafuse LT is a novel, low-temperature alloy system created to give high-reliability in low-temperature applications that require a reflow temperature below 210C. Where traditional low-temperature solders often produce brittle solder joints that are susceptible to drop shock failures,

The system provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.

The alloy provides a solution for heat-sensitive components and flex polymers. The solution prevents thermal warpage of processor components and multilayer boards and meets low-temperature demands for step soldering, particularly in RF shield attachment and rework applications.

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