SET Corporation has officially launched the FC150 PLATINUM for the automotive, defence, telecom, quantum, HPC, AI, and VR markets. This new equipment is the latest version of the b
Industrial | 22-11-2022
SET (Smart Equipment Technology) has released the NEO HB, an automatic flip-chip bonder designed for ±1µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM). Th
Subs & Systems | 25-11-2019
