Advanced R&D flip-chip bonder launched for multiple markets

SET Corporation has officially launched the FC150 PLATINUM for the automotive, defence, telecom, quantum, HPC, AI, and VR markets. This new equipment is the latest version of the b

Industrial | 22-11-2022

New automatic flip-chip bonder dedicated to device production

SET (Smart Equipment Technology) has released the NEO HB, an automatic flip-chip bonder designed for ±1µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM). Th

Subs & Systems | 25-11-2019