Cadence Design Systems, Inc has announced that Arm is leveraging Cadence Liberate MX Trio Characterisation to enhance the quality of its embedded memory instances and compilers and quicken time to market. With Liberate MX Trio Characterisat

Cadence | 09-08-2022

BittWare has introduced new card and server-level solutions featuring Intel Agilex FPGAs. The new BittWare IA-860m assists customers in alleviating memory-bound application workloads by employing up to 32GB of HBM2e in-package memory and 16

BittWare | 05-08-2022

Infineon Technologies AG has added HYPERRAM 3.0 to its portfolio of high-bandwidth, low-pin count memory solutions. The device provides a new, 16-bit extended version of the HyperBus interface that doubles throughput to 800MBps. With the so

Infineon | 04-08-2022

Microchip Technology Inc has expanded its serial-attached memory controller portfolio with the new SMC 2000 series of Compute Express Link (CXL) based Smart Memory Controllers that allow CPUs, GPUs and SoCs to utilise CXL interfaces to conn

Microchip Technology | 04-08-2022

Winbond Electronics Corporation offers its new package 100BGA LPDDR4/4X, announcing it had achieved the JEDEC JED209-4 standard to provide energy conservation and carbon reduction. The device is now available in a space-saving 100BGA pac

Winbond | 02-08-2022

Mouser has signed an agreement with ATP Electronics for specialised storage and memory solutions. The agreement now provides customers with the company's memory cards, SSDs, and managed NAND devices for industrial and automotive application

Mouser Electronics | 14-07-2022

Alliance Memory has announced its technology lineup for Embedded World 2022. The company will highlight its latest SRAM, DRAM, flash, and storage memory ICs for embedded platforms. "It's been more than two years since Alliance Memory has

Alliance Memory | 16-05-2022

Apacer is launching JEDEC Raw Card Revision 1.0 mass production versions of DDR5 UDIMM, RDIMM, SODIMM, ECC UDIMM and ECC SODIMM industrial memory. As one of the first memory module manufacturers able to start mass production of DDR5, the ga

Apacer | 10-05-2022

Microchip Technology Inc. proposed the concept of starting with COTS devices and then replacing them with space-qualified, RT equivalent parts. The company has announced it has extended its family of COTS-based RT SuperFlash options for the

Microchip Technology | 25-04-2022

SEGGER's Embedded Studio for Arm Version 6 provides real-time memory management, which improves efficiency and response time for allocating and freeing up memory, allowing hard real-time to applications written in C++. This brings the so

Segger | 07-04-2022

KIOXIA Europe GmbH has started sampling new Automotive UFS Ver. 3.1 embedded flash memory devices. The new line-up uses the company’s BiCS FLASH 3D flash memory and is available in capacities from 64GB to 512GB to support the multiple deman

Kioxia | 04-04-2022

Teledyne e2v Semiconductors’ ultra-high-density DDR4 memories are now being shipped to key customers worldwide. With a 4GByte storage capacity and dimensions of only 15mm x 20mm x 1.92mm, Teledyne e2v’s DDR4s display a far higher storage

Teledyne FLIR | 24-03-2022

Hyperstone has released its new S9 family of SD and microSD memory card controllers. In the tradition of its aspiration to offer the most reliable NAND flash controllers, the family satisfies the needs of demanding applications with turnkey

Hyperstone | 10-03-2022

Computing-in-memory technology is balanced to eradicate the massive data communications bottlenecks otherwise associated with performing AI speech processing at the network’s edge. However, it needs an embedded memory solution that simultan

Microchip Technology | 03-03-2022