Cadence

Collaboration accelerates hyperscale computing and 5G communications SoC development

04-05-2021 | New Technologies

Extended product line with New DSPs targeting high-end and always-on applications

27-04-2021 | Subs & Systems

Collaboration Accelerates Hyperscale Computing SoC Design for Process Nodes

13-04-2021 | New Technologies

Simulation solution delivers up to 10X faster system-level EMI simulation

20-10-2020 | New Technologies

Multi-standard memory interface IP targets high-capacity low-power and low-cost applications

15-10-2020 | Semiconductors

Die-to-die connectivity IP addressing supports organic substrate packaging

02-09-2020 | Subs & Systems

Simulator has been enhanced with machine learning technology

14-08-2020 | Test & Measurement

Optimised software enables low-power neural network inferencing

18-03-2020 | Subs & Systems

Extended cloud leadership with new platform for hybrid cloud environments

03-04-2019 | New Technologies

Next-generation cloud datacenter infrastructure delivers industry-leading PPA efficiency

24-10-2018 | New Technologies

Emulation platform accelerates SoC verification tests up to 795X faster

16-08-2018 | Subs & Systems

New release accelerates PCB design cycles by integrating 3D design and 3D analysis

24-07-2018 | Design & Manufacture

Full-flow digital and signoff tools for mobile Arm-based designs

05-06-2018 | Subs & Systems

Vision and AI performance boosted on new DSP

16-04-2018 | Subs & Systems