Cadence

Accelerating system innovation with breakthrough 3D-IC platform

15-10-2021 | Design & Manufacture

Accelerated intelligent SoC development with on-device AI platform

21-09-2021 | Design & Manufacture

Processors address most stringent automotive functional safety requirements

05-08-2021 | Automotive Technologies

Extending digital design leadership with revolutionary ML technology

28-07-2021 | Design & Manufacture

Collaboration enables easy adoption of integrated digital full flow

16-07-2021 | Design & Manufacture

Floating point DSP family delivers scalable performance

22-06-2021 | Design & Manufacture

Design platform revolutionises system design

14-06-2021 | Design & Manufacture

Secure and scalable electromagnetic analysis of complex systems on AWS

04-06-2021 | Subs & Systems

Collaboration accelerates hyperscale computing and 5G communications SoC development

04-05-2021 | New Technologies

Extended product line with New DSPs targeting high-end and always-on applications

27-04-2021 | Subs & Systems

Collaboration Accelerates Hyperscale Computing SoC Design for Process Nodes

13-04-2021 | New Technologies

Simulation solution delivers up to 10X faster system-level EMI simulation

20-10-2020 | New Technologies

Multi-standard memory interface IP targets high-capacity low-power and low-cost applications

15-10-2020 | Semiconductors

Die-to-die connectivity IP addressing supports organic substrate packaging

02-09-2020 | Subs & Systems