Teledyne e2v Semiconductors’ ultra-high-density DDR4 memories are now being shipped to key customers worldwide.
With a 4GByte storage capacity and dimensions of only 15mm x 20mm x 1.92mm, Teledyne e2v’s DDR4s display a far higher storage density than competing solutions – taking up just half the PCB real estate and nearly an order of magnitude less volume. Maintaining high performance on an ongoing basis, they deliver data transfer speeds of 2.4GT/s.
Supplied in a multi-chip package format, each DDR4T04G72 memory features expansive bus capabilities, where 64bits are designated to data transfer and an extra 8bits for error correction. The memory is an optimal companion for the company’s Qormino processors, and they are also compatible with most processors, SoCs and FPGAs from other vendors.
Thanks to their high-reliability construction and high radiation tolerance, these devices will be a key resource for space-deployed edge computing platforms. Radiation testing and characterisation conducted on these DDR4s show that their SEL threshold is greater than 60MeV.cm²/mg. Their SEU and SEFI data also exceeds 60MeV.cm²/mg, and they have demonstrated resilience to 100krad TID.
The DDR4s can be ordered in industrial temperature range (-40C to 105C) and defence temperature range (-55C to 125C), and up to NASA Level 1 (based on NASA EEE-INST-002 - Section M4 - PEMs). This will mean that a higher breadth of potential applications can be addressed.
“We are recognised as leading the way in elevated density radiation-tolerant memory for space applications, and our technology has already been incredibly well received by the market. What differentiates us from the competition is the comprehensive and open data package we provide, giving clients everything they require to start their designs and complete them in the shortest possible timeframe, with all the background information and expert engineering support readily available,” states Thomas Guillemain, marketing and business development manager at Teledyne e2v. “The space industry is presented with an assured supply of compact, easy to interface memories that raise the performance benchmark. We are making great headway on the next stage of our roadmap, with other generations of even higher capacity devices currently in the pipeline.”