Intertronics now offers Bond2Bond Aquafast, a new single-part, 'instant' adhesive ideal for environments with high humidity. The adhesive is a low odour, low bloom, medium-viscosity cyanoacrylate (CA) adhesive that provides outstanding adhe
Intertronics | 04-11-2022
The E+E Elektronik HTM502 sensing module provides a cost-effective humidity and temperature measurement solution. It is characterised by straightforward implementation, high accuracy, and reliability. Integration and interchangeability thro
E+E Elektronik | 19-10-2022
Advantech has released a pair of new SQFlash PCIe Gen.4 SSD solutions: the SQF 930 and SQF ER-1. IoT is forcing growing demand for high-performance storage. Consequently, the solutions provide industrial heat dissipation capabilities that s
Advantech | 05-09-2022
Voltcraft’s WB 500 IR camera, available now from Conrad Electronics, provides high-tech features suitable for tackling the most challenging tasks. It offers a high frame rate of 50fps, ensuring non-blurry images of moving parts of equipment
Conrad Electronic | 12-07-2022
Teledyne FLIR has added the E52 camera to its range of Exx thermal Imaging devices, including the E96, E86, E76 and E54 models. The new camera provides professional-quality thermal resolution to deliver images that are easy to read and on-c
Teledyne FLIR | 08-06-2022
Parker Chomerics has released new solutions to protect drones from EMI and overheating. Drones functioning near cell phone towers, buildings, antennae, high-voltage power lines and other obstacles can be affected by serious EMI, compromi
Parker Chomerics | 17-05-2022
Teledyne FLIR has released the Boson+ with thermal sensitivity of 20mK or less, making it the most sensitive LWIR camera currently available. It shares the industry-leading SWaP of the Boson thermal camera module. With identical mechanical,
Teledyne FLIR | 08-04-2022
Nexperia has released new, enhanced electrothermal models for its MOSFET devices. The new advanced models capture the thermal interdependency of the whole set of device parameters across the entire operating temperature range from -55C to 1
Nexperia | 30-03-2022
Teledyne FLIR has released an expanded free thermal dataset for ADAS and self-driving vehicle researchers and developers. The expanded starter dataset almost doubles the original, industry-first free dataset and provides more than 26,000 an
Teledyne FLIR | 08-03-2022
Teledyne FLIR has released two families of X-Series science cameras, the X858x and X698x, providing high-speed and high-resolution thermal imaging abilities for scientific research and engineering applications within the MWIR and LWIR spect
Teledyne FLIR | 01-02-2022
Teledyne FLIR has introduced two new additions to its VS290 Thermal Videoscope Kit family of devices – the VS290-33 Thermal MSX Videoscope Kit and the VS29-21 Thermal Videoscope Kit. The VS290-33 provides a rounded, dual thermal-visible pro
Teledyne FLIR | 19-01-2022
Reliable temperature data is crucial in fast-paced electronics manufacturing environment. Solderstar has employed its extensive knowledge and technical expertise to create the SLX, an innovative thermal profiler with the advantage of having
13-01-2022
The Chomerics division of Parker Hannifin Corporation has introduced its next generation of thermal gap filler pads - THERM-A-GAPTM PAD 30 and 60 - for all heat transfer applications between electronic components and heat sinks. With a r
Parker Chomerics | 29-12-2021
ROHM has recently added a new thermal analysis function to its ROHM Solution Simulator. The new feature provides electronic circuits and systems designers in the automotive and industrial markets to collectively verify power devices and dri
ROHM Semiconductor | 10-12-2021
