Thermal Management

Nexperia has released new, enhanced electrothermal models for its MOSFET devices. The new advanced models capture the thermal interdependency of the whole set of device parameters across the entire operating temperature range from -55C to 1

Nexperia | 30-03-2022

Teledyne FLIR has released an expanded free thermal dataset for ADAS and self-driving vehicle researchers and developers. The expanded starter dataset almost doubles the original, industry-first free dataset and provides more than 26,000 an

Teledyne FLIR | 08-03-2022

Teledyne FLIR has released two families of X-Series science cameras, the X858x and X698x, providing high-speed and high-resolution thermal imaging abilities for scientific research and engineering applications within the MWIR and LWIR spect

Teledyne FLIR | 01-02-2022

Teledyne FLIR has introduced two new additions to its VS290 Thermal Videoscope Kit family of devices – the VS290-33 Thermal MSX Videoscope Kit and the VS29-21 Thermal Videoscope Kit. The VS290-33 provides a rounded, dual thermal-visible pro

Teledyne FLIR | 19-01-2022

Reliable temperature data is crucial in fast-paced electronics manufacturing environment. Solderstar has employed its extensive knowledge and technical expertise to create the SLX, an innovative thermal profiler with the advantage of having

13-01-2022

The Chomerics division of Parker Hannifin Corporation has introduced its next generation of thermal gap filler pads - THERM-A-GAPTM PAD 30 and 60 - for all heat transfer applications between electronic components and heat sinks. With a r

Parker Chomerics | 29-12-2021

ROHM has recently added a new thermal analysis function to its ROHM Solution Simulator. The new feature provides electronic circuits and systems designers in the automotive and industrial markets to collectively verify power devices and dri

ROHM Semiconductor | 10-12-2021

Lynred’s new range of 12-micron products provides optronics systems with higher performance levels to more accurately identify objects in low-contrast scenes. The company now offers enhanced capabilities over the complete range of its 12

Lynred | 30-11-2021

Schurter’s Reflowable Thermal Switch, RTS, now comprises a version intended to trip at >175C, as well as the existing variant set to trip at >210C. The compact thermal SMD fuse protects power semiconductors by precisely and reliabl

Schurter | 19-11-2021

Posifa Technologies has released the new PGS1000 series of MEMS thermal conductivity hydrogen sensors. Created for stable, cost-effective safety monitoring in environments where hydrogen is employed and stored, the devices comprise two ther

Posifa Technologies | 15-11-2021

Master Bond EP5G-80 is a one-component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80C for four hours. This graphite filled compound is not premixed and frozen. It has an unlimited working life at room

Masterbond | 01-09-2021

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an excellent thermal conductivity of 16-17W/(m·K). It cures swiftly at temperatures of around 250-300F (~125-150C) and offers an unlimited working life at room tempe

Masterbond | 22-07-2021

Created to scan large areas for moisture issues, air leaks, electrical problems, and more, the FLIR MR265 Moisture Meter and Thermal Imager with MSX enables professionals to swiftly identify and find water leaks and other moisture issues at

Teledyne FLIR | 07-07-2021

New Yorker Electronics now offers the Vishay’s ThermaWick THJP Series of Surface-mount Thermal Jumper Chips. The Vishay Dale Thin Film device enables designers to transfer heat from electrically isolated components by implementing a thermal

New Yorker Electronics | 20-05-2021