Fluke has developed a range of thermal imaging and wireless testing tools to ensure safety is the highest priority for engineers working in potentially dangerous arc flash zones. Every company's electrical safety strategy should be based
Fluke | 06-11-2023
CUI Devices' Thermal Management Group has launched its new thermal design services. With a team of thermal management experts, its industry-leading thermal design services employ advanced simulation tools and decades of expertise to determi
CUI Devices | 13-10-2023
The Chomerics Division of Parker Hannifin Corporation is launching SOFT-SHIELD 3800, an electrically conductive fabric over silicone foam EMI shielding and electrical grounding gasket for low closure force and high-temperature electronics a
Parker Hannifin plc | 11-10-2023
TDK Corporation now offers the new T850 SMT NTC sensor (B57850T0103*) for measuring surface temperatures. It integrates high humidity resistance with fast response time due to exceptional thermal coupling to the target. The sensor is suited
TDK | 29-09-2023
Mouser has a new global distribution agreement with Microtherm Sentronic, suppliers of sensor control technology. Microtherm Sentronic manufactures temperature measurement solutions and overheating protection switches for industrial and hou
Mouser Electronics | 03-08-2023
Mouser announced a distribution agreement with Atmosic Technologies, a leading manufacturer of ultra-low-power wireless solutions for IoT applications. According to the agreement, Mouser will offer customers Atmosic's range of high-performa
Mouser Electronics | 20-07-2023
CUI Devices’ Thermal Management Group has continued the expansion of its DC fans and blowers product lines with new smaller frame sizes. The company’s DC axial fans now provide frame sizes as small as 20mm x 20mm x 6mm and expanded airflow
CUI Devices | 19-07-2023
The Chomerics Division of Parker Hannifin Corporation unveils a new thermal interface gel that is excellent for all manufacturers facing the challenges of high-throughput production. Providing flow rates of up to 100g/min, the new THERM-A-G
Parker Chomerics | 13-06-2023
Magna-Power Electronics has introduced Pitel Paste, a high-performance thermal paste for power electronics applications. The first formula introduced, Pitel Paste AZ-01, has been formulated and refined over the previous eight years, balanci
Magna Power | 23-05-2023
The Master Bond EP17HTDA-2 is a one-component epoxy that may be employed for bonding, sealing and die attachment. It is not premixed and frozen, and it cures with heat. This dimensionally stable system offers exceptional mechanical properti
Masterbond | 25-04-2023
Würth Elektronik will be exhibiting at embedded world. True to its motto, "more than you expect!" the manufacturer will showcase its services to assist its customers in bringing their products to market faster. These range from online platf
Wurth | 28-02-2023
Master Bond EP41S-5Med is a two-part epoxy system that meets the demands of ISO 10993-5 for non-cytotoxicity and can be employed for sealing, bonding, and coating in medical devices. It offers high-temperature resistance and excellent stren
Masterbond | 13-02-2023
DELO has created a line lamp for curing adhesives and other multi-functional polymers. DELOLUX 301 is ideal for highly automated processes in small and narrow production lines. The lamp provides the highest curing speeds and excellent flexi
DELO | 06-02-2023
Diodes Incorporated has released its first SiC SBD. The portfolio includes the DIODES DSCxxA065 series with 11 products rated at 650V (4A, 6A, 8A, and 10A) and the DIODES DSCxx120 series with eight products rated at 1200V (2A, 5A, and 10A).
Diodes Inc | 02-02-2023