NXP Semiconductors Layerscape and Layerscape Access family of processors have been selected by Compal Electronics to power its new 5G Integrated Small Cell (ISC) solution. Designed to enhance 5G networks density, the new solution delivers h

NXP | 08-03-2022

Microchip Technology Inc. now offers its newest member of the Flashtec controller family, the NVMe 4016 SSD controller. As the industry's highest-performing PCIe Gen 5 NVMe SSD controller, the Flashtec NVMe 4016 satisfies the market demand

Microchip Technology | 08-03-2022

Micron Technology, Inc. is sampling the world's first vertically-integrated 176-layer NAND SSD for the data centre. The Micron 7450 SSD with NVMe delivers quality-of-service QoS latency at or below 2ms, a wide capacity range and the broades

Micron | 07-03-2022

Renesas Electronics Corporation has launched the RZ/Five general-purpose MPUs constructed around a 64-bit RISC-V CPU core. The device employs the Andes AX45MP, based on the RISC-V CPU ISA. It augments the company’s previously available Arm

Renesas | 04-03-2022

Computing-in-memory technology is balanced to eradicate the massive data communications bottlenecks otherwise associated with performing AI speech processing at the network’s edge. However, it needs an embedded memory solution that simultan

Microchip Technology | 03-03-2022

Apacer Technology Inc. SH250-M280 Anti-Sulfuration SSDs, available now from Mouser, are well-balanced SSDs drives that come with a standard form factor and exceptional performance. These SSDs are designed in SATA 6Gb/s interface can deliver

Mouser Electronics | 02-03-2022

ROHM has developed the D/A converter IC (DAC chip) BD34352EKV and the corresponding evaluation board BD34352EKV-EVK-001 to support the playback of high-resolution sound sources in high fidelity audio equipment. Created to maximally extra

ROHM Semiconductor | 02-03-2022

NXP Semiconductors has released the most secure member of its MIFARE Ultralight family. The MIFARE Ultralight AES utilises standard AES authentication with Common Criteria EAL3+ security certification to provide privacy and security to limi

NXP | 02-03-2022

Renesas Electronics Corporation develops two 2.4GHz RF transceiver technologies that support the Bluetooth LE low-power, near-field communication standard. The new technologies also fulfil a smaller mounting area and better power efficiency

Renesas | 02-03-2022

Toshiba Electronics Europe GmbH has released an ultra-low capacitance TVS diode. The product will serve a useful function in shielding electronic components such as semiconductors from static electricity and noise whilst suppressing signal

Toshiba | 02-03-2022

Littelfuse, Inc. offers the new SPxxR6, a series of four-channel, low capacitance (0.2pF) TVS diode arrays. These robust diodes deliver extremely low breakdown/turn-on voltages, making them excellent protectors of high-speed data lines with

Littelfuse | 28-02-2022

Infineon Technologies AG now offers the MERUS two-channel, analog input, class D audio amplifier multichip module (MCM) MA5332MS. It is a powerful upgrade to its predecessor, providing the same or even higher output power than monolithic al

Infineon | 24-02-2022

Innoscience Technology has released the INN40W08, a 40V bi-directional GaN-on-Si enhancement mode HEMT for mobile devices, laptops and cellular phones. The device has been produced employing the company's advanced InnoGaN technology, which

Innoscience Technology | 23-02-2022

Diodes Incorporated has released an ideal diode controller for system protection against reverse discharge. Emulating an ideal diode by driving a P-channel MOSFET, the DZDH0401DW controller offers the high-side rail isolation required for r

Diodes Inc | 23-02-2022