Evolving security and functional safety demands, together with the growing complexity of real-time embedded applications, are driving designers to seek innovative solutions that deliver greater accuracy, improved reliability and compliance
Microchip Technology | 27-06-2025
X-FAB Silicon Foundries SE has released a new isolation class within its 180nm XH018 semiconductor process. Designed to support more compact and efficient SPAD implementations, this new isolation class allows tighter functional integration,
X-FAB | 27-06-2025
Toshiba Electronics Europe GmbH has expanded its lineup of isolation devices with four AEC-Q100-qualified, two-channel, high-speed digital isolators. The new DCM32xx00 series supports stable operation with a high CMTI of 100kV/µs (typ.) at
Toshiba | 27-06-2025
Silanna Semiconductor has released the SL2002, the second breakthrough product in its FirePower family of laser driver ICs. The device has been optimised for low-voltage operation in small-form-factor systems, facilitating powerful laser
Silanna Semiconductor | 26-06-2025
Phlux Technology has announced a 30µm optical window version of the Aura family of 1550nm Noiseless InGaAs APDs. The sensors, which are also available in 80µm and 200µm versions, are 12 times more sensitive than conventional InGaAs APDs
Phlux Technology | 25-06-2025
Electronic identification (eID) documents are experiencing a growing demand worldwide as governments accelerate their digitalisation efforts. To fulfil these rapidly evolving requirements more quickly and flexibly, Infineon Technologies AG
Infineon | 25-06-2025
GigaDevice has launched the GD32C231 series of entry-level MCUs, further expanding its Arm Cortex-M23 core product lineup. The company positions the series as a "high-performance entry-level" solution created to offer more competitive optio
GigaDevice | 24-06-2025
The Texas Instruments TCAN284x-Q1 is a family of system basis chips (SBC) that provide a CAN FD (Control Area Network Flexible Data Rate) transceiver, supporting selective wake. The device includes a LIN transceiver. The CAN FD transceiver
Texas Instruments | 20-06-2025
SureCore has launched a comprehensive suite of silicon services to help customers develop cutting-edge applications that address complex design requirements. Leveraging its extensive experience in low-power and low-voltage design, the team
SureCore | 17-06-2025
Renesas Electronics Corporation has released the RA2L2 MCU group with ultra-low power consumption and the industry’s first support for the new UCB-C Revision 2.4 standard. Based on a 48MHz Arm Cortex M23 processor, the new MCUs provide a ri
Renesas | 17-06-2025
WIN SOURCE offers the Microchip Technology ATXMEGA32D3-AU, a powerful, low-power MCU that provides cutting-edge performance for embedded systems. This 32-bit MCU is part of the XMEGA family, delivering advanced processing capabilities that
WIN SOURCE | 16-06-2025
Infineon Technologies AG is collaborating with Typhoon HIL to provide automotive engineering teams with a fully integrated, real-time development and test environment for key elements of xEV powertrain systems. Customers working with Infine
Infineon | 13-06-2025
Alphawave Semi has successfully taped out of one of the industry's first UCIe IP subsystem on TSMC's N2 process, supporting 36G die-to-die data rates. The solution is fully integrated with TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced
Alphawave Semi | 12-06-2025
Mouser Electronics, Inc. now stocks the DA14533 Bluetooth 5.3 SoC from Renesas Electronics. Featuring advanced power management capabilities, the Bluetooth SoC simplifies integration, decreases power consumption, and lengthens the operation
Mouser Electronics | 11-06-2025
29-08-2025 | Insights | By Robin Mitchell
29-08-2025 | Insights | By Robin Mitchell
28-08-2025 | Insights | By Robin Mitchell