Semiconductors


Enhanced DSC lineup offers industry-leading PWM resolution and ADC speed

Evolving security and functional safety demands, together with the growing complexity of real-time embedded applications, are driving designers to seek innovative solutions that deliver greater accuracy, improved reliability and compliance

Microchip Technology | 27-06-2025

Expanded 180nm process with new isolation class for enhanced SPAD integration

X-FAB Silicon Foundries SE has released a new isolation class within its 180nm XH018 semiconductor process. Designed to support more compact and efficient SPAD implementations, this new isolation class allows tighter functional integration,

X-FAB | 27-06-2025

Introducing two-channel automotive high-speed digital isolators

Toshiba Electronics Europe GmbH has expanded its lineup of isolation devices with four AEC-Q100-qualified, two-channel, high-speed digital isolators. The new DCM32xx00 series supports stable operation with a high CMTI of 100kV/µs (typ.) at

Toshiba | 27-06-2025

Laser driver ICs enable small and efficient rangefinders running off 3V coin cells

Silanna Semiconductor has released the SL2002, the second breakthrough product in its FirePower family of laser driver ICs. The device has been optimised for low-voltage operation in small-form-factor systems, facilitating powerful laser

Silanna Semiconductor | 26-06-2025

High-speed and high-bandwidth avalanche photodiodes added to family of infrared sensors

Phlux Technology has announced a 30µm optical window version of the Aura family of 1550nm Noiseless InGaAs APDs. The sensors, which are also available in 80µm and 200µm versions, are 12 times more sensitive than conventional InGaAs APDs

Phlux Technology | 25-06-2025

Expanded government ID portfolio for enhanced flexibility and faster time-to-market

Electronic identification (eID) documents are experiencing a growing demand worldwide as governments accelerate their digitalisation efforts. To fulfil these rapidly evolving requirements more quickly and flexibly, Infineon Technologies AG

Infineon | 25-06-2025

MCU redefines cost-performance and unleashes new potential

GigaDevice has launched the GD32C231 series of entry-level MCUs, further expanding its Arm Cortex-M23 core product lineup. The company positions the series as a "high-performance entry-level" solution created to offer more competitive optio

GigaDevice | 24-06-2025

Automotive CAN FD and LIN SBC with partial networking

The Texas Instruments TCAN284x-Q1 is a family of system basis chips (SBC) that provide a CAN FD (Control Area Network Flexible Data Rate) transceiver, supporting selective wake. The device includes a LIN transceiver. The CAN FD transceiver

Texas Instruments | 20-06-2025

Comprehensive suite of silicon services launched

SureCore has launched a comprehensive suite of silicon services to help customers develop cutting-edge applications that address complex design requirements. Leveraging its extensive experience in low-power and low-voltage design, the team

SureCore | 17-06-2025

New MCUs for portable devices such as data loggers and charge cases

Renesas Electronics Corporation has released the RA2L2 MCU group with ultra-low power consumption and the industry’s first support for the new UCB-C Revision 2.4 standard. Based on a 48MHz Arm Cortex M23 processor, the new MCUs provide a ri

Renesas | 17-06-2025

Enhanced MCU functionality for embedded systems

WIN SOURCE offers the Microchip Technology ATXMEGA32D3-AU, a powerful, low-power MCU that provides cutting-edge performance for embedded systems. This 32-bit MCU is part of the XMEGA family, delivering advanced processing capabilities that

WIN SOURCE | 16-06-2025

Collaboration accelerates the development of xEV power electronic systems

Infineon Technologies AG is collaborating with Typhoon HIL to provide automotive engineering teams with a fully integrated, real-time development and test environment for key elements of xEV powertrain systems. Customers working with Infine

Infineon | 13-06-2025

Breakthrough unlocks foundational AI platform IP on nanosheet processes

Alphawave Semi has successfully taped out of one of the industry's first UCIe IP subsystem on TSMC's N2 process, supporting 36G die-to-die data rates. The solution is fully integrated with TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced

Alphawave Semi | 12-06-2025

Bluetooth 5.3 SoC reduces power consumption in automotive applications

Mouser Electronics, Inc. now stocks the DA14533 Bluetooth 5.3 SoC from Renesas Electronics. Featuring advanced power management capabilities, the Bluetooth SoC simplifies integration, decreases power consumption, and lengthens the operation

Mouser Electronics | 11-06-2025

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