Semiconductors


SiC diodes portfolio now addresses automotive and wider industrial applications

Nexperia has announced that its class-leading 650V, 10A SiC Schottky diode is now automotive qualified (PSC1065H-Q) and offered in real-two-pin (R2P) DPAK (TO-252-2) packaging, making it suited to various applications in EVs and other autom

Nexperia | 17-06-2024

First GaN IPM to enable smaller and more energy-efficient high-voltage motors

Texas Instruments has released the industry’s first 650V three-phase GaN IPM for 250W motor drive applications. The new GaN IPM addresses many design and performance compromises engineers commonly face when designing major home appliances a

Texas Instruments | 12-06-2024

New GaN power IC packages deliver enhanced thermal performance

Cambridge GaN Devices (CGD), the company that develops energy-efficient GaN-based power devices that make greener electronics possible, has announced two new packages for the company’s ICeGaN family of GaN power ICs that supply enhanced the

Cambridge GaN Devices | 11-06-2024

First 32-bit low-power MCU with in-house RISC-V CPU core

Mouser now stocks the R9A02G021 low-power MCUs from Renesas Electronics. Empowering engineers with a multipurpose platform for creating power-efficient, cost-effective applications using an open-source ISA, the R9A02G021 is the company's fi

Mouser Electronics | 10-06-2024

Load switches provide smart power delivery solutions for modern digital ICs

Diodes Incorporated has expanded its DML30xx series smart load switches. The four new products, DML3008LFDS, DML3010ALFDS, DML3011ALFDS, and DML3012LDC, provide high-current (10.5A to 15A) power domain switching control for voltage rails fr

Diodes Inc | 06-06-2024

MOSFETs redefine power density and efficiency in AI server power supplies

With the increasing power demands of AI processors, server PSUs must supply more and more power without surpassing the defined dimensions of the server racks. This is driven by a surge in energy demand of high-level GPUs, which may consume

Infineon | 05-06-2024

Revolutionary flip-chip die bonder faster than current market leaders

ITEC has released the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines and can attach up to 60,000 flip-chip dies per hour. The company aims to help manufacturers lower their factory footprint a

ITEC | 05-06-2024

New SOM delivers performance and cost

Mouser now ships the Kria K24 SOM from AMD/Xilinx. The K24 SOM features a cost-optimised, custom-built Zynq UltraScale+ MPSoC device about half the size of a credit card for customers seeking the right power, cost, and performance for DSP-i

Mouser Electronics | 04-06-2024

Empowering innovation at PCIM Europe 2024

Mouser will empower innovation at this year's PCIM Europe exhibition at the Nürnberg Messe in Nuremberg, Germany. The power electronics community will join together to learn more about the latest trends and innovations in power electronics,

Mouser Electronics | 03-06-2024

NFC I2C bridge tag for contactless authentication and secured configuration of IoT devices

Infineon Technologies AG has launched the OPTIGA Authenticate NBT, a high-performance NFC I2C bridge tag for single-tap authentication and secured configuration of IoT devices. It is the only asymmetric cryptography tag for sign and verify

Infineon | 03-06-2024

Parallel measurement of multiple water parameters with a single sensor chip

The Fraunhofer Institute for Photonic Microsystems IPMS presents ground-breaking integration technology for the simultaneous measurement of various water parameters using ISFETs. The newly developed n-well integration technology makes it po

Fraunhofer | 31-05-2024

GaN SiP targets rapid consumer device charging

Wise-integration and Leadtrend Technology Corporation has released a GaN SiP supporting consumer electronics applications. Their collaboration’s targeted application is a 65W USB PD adapter for high-speed charging of smartphones, laptops

Wise-integration | 31-05-2024

Next-gen AI SoCs for fleet dash cams and vehicle gateways

Ambarella, Inc. has announced its latest AI SoCs generation for in-vehicle fleet telematics systems. Ideal for AI dash cams integrating front-facing ADAS and DMS, the new CV75AX provides up to 2x the AI performance over its prior-generation

Ambarella | 30-05-2024

SiC MOSFETs now deliver class-leading performance in SMD packaging

Nexperia has announced that it now offers its industry-leading 1200V SiC MOSFETs in D2PAK-7 SMD packaging, with a choice of 30, 40, 60, and 80mOhm RDSon values. This announcement follows its late-2023 release of two discrete SiC MOSFETs in

Nexperia | 30-05-2024

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