MOSFETs redefine power density and efficiency in AI server power supplies

With the increasing power demands of AI processors, server PSUs must supply more and more power without surpassing the defined dimensions of the server racks. This is driven by a surge in energy demand of high-level GPUs, which may consume

Infineon | 05-06-2024

Revolutionary flip-chip die bonder faster than current market leaders

ITEC has released the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines and can attach up to 60,000 flip-chip dies per hour. The company aims to help manufacturers lower their factory footprint a

ITEC | 05-06-2024

New SOM delivers performance and cost

Mouser now ships the Kria K24 SOM from AMD/Xilinx. The K24 SOM features a cost-optimised, custom-built Zynq UltraScale+ MPSoC device about half the size of a credit card for customers seeking the right power, cost, and performance for DSP-i

Mouser Electronics | 04-06-2024

Empowering innovation at PCIM Europe 2024

Mouser will empower innovation at this year's PCIM Europe exhibition at the Nürnberg Messe in Nuremberg, Germany. The power electronics community will join together to learn more about the latest trends and innovations in power electronics,

Mouser Electronics | 03-06-2024

NFC I2C bridge tag for contactless authentication and secured configuration of IoT devices

Infineon Technologies AG has launched the OPTIGA Authenticate NBT, a high-performance NFC I2C bridge tag for single-tap authentication and secured configuration of IoT devices. It is the only asymmetric cryptography tag for sign and verify

Infineon | 03-06-2024

Parallel measurement of multiple water parameters with a single sensor chip

The Fraunhofer Institute for Photonic Microsystems IPMS presents ground-breaking integration technology for the simultaneous measurement of various water parameters using ISFETs. The newly developed n-well integration technology makes it po

Fraunhofer | 31-05-2024

GaN SiP targets rapid consumer device charging

Wise-integration and Leadtrend Technology Corporation has released a GaN SiP supporting consumer electronics applications. Their collaboration’s targeted application is a 65W USB PD adapter for high-speed charging of smartphones, laptops

Wise-integration | 31-05-2024

Next-gen AI SoCs for fleet dash cams and vehicle gateways

Ambarella, Inc. has announced its latest AI SoCs generation for in-vehicle fleet telematics systems. Ideal for AI dash cams integrating front-facing ADAS and DMS, the new CV75AX provides up to 2x the AI performance over its prior-generation

Ambarella | 30-05-2024

SiC MOSFETs now deliver class-leading performance in SMD packaging

Nexperia has announced that it now offers its industry-leading 1200V SiC MOSFETs in D2PAK-7 SMD packaging, with a choice of 30, 40, 60, and 80mOhm RDSon values. This announcement follows its late-2023 release of two discrete SiC MOSFETs in

Nexperia | 30-05-2024

Free webinar on the future of smart home security

Mouser has partnered with Infineon Technologies to offer the engineering community a new webinar, 'Secured Smart Access: Building the Future of Smart Homes'. The free webinar will take place on June 18th, 2024, at 17:00 CET. As our homes

Mouser Electronics | 29-05-2024

Radiation-tolerant MCU portfolio for the aerospace and defence market

Microchip Technology has announced the SAMD21RT, a radiation-tolerant (RT) Arm Cortex-M0+ based 32-bit MCU in a 64-pin ceramic and plastic package with 128KB Flash and 16KB SRAM. Designed for space-constrained applications where size and

Microchip Technology | 29-05-2024

Enhanced automotive-grade high-voltage CMOS foundry solution

X-FAB Silicon Foundries SE has updated its XP018 high-voltage CMOS semiconductor fabrication platform with new 40V and 60V high-voltage primitive devices, which offer an extended SOA for enhanced operational robustness. These second-generat

X-FAB | 28-05-2024

Empowering growth and inspiring innovation with highly efficient EcoGaN and SiC power solutions

ROHM will present its new power semiconductor solutions, with a special focus on wide bandgap devices, at this year's PCIM Europe. Its SiC, Si and GaN portfolio is designed to fulfil the needs of various sectors – focusing on e-mobility and

ROHM Semiconductor | 24-05-2024

High-performance FPGA offers performance and cost-efficiency

The Xilinx Kintex-7 series, available now from WIN SOURCE, is designed to deliver an outstanding balance of performance and cost-efficiency for various high-performance applications. This FPGA employs the advanced 28nm High-K Metal Gate (HK

WIN SOURCE | 24-05-2024