Alphawave Semi


Breakthrough unlocks foundational AI platform IP on nanosheet processes

Alphawave Semi has successfully taped out of one of the industry's first UCIe IP subsystem on TSMC's N2 process, supporting 36G die-to-die data rates. The solution is fully integra

Semiconductors | 12-06-2025

Consortium accelerates high-speed AI connections

Alphawave Semi has joined the newly formed Ultra Accelerator Link Consortium (UALink). With the emergence of accelerated compute infrastructure to facilitate AI workloads spanning

Industrial | 06-12-2024

Driving innovation in hyperscale AI accelerators with advanced I/O chiplet

Alphawave Semi has announced that Rebellions Inc. has selected its multiprotocol I/O Connectivity Chiplets for its next-generation product, REBEL. This collaboration will allow Reb

Semiconductors | 05-12-2024

First 3nm UCIe IP with TSMC CoWoS packaging launched

Alphawave Semi has launched the industry's first successful 3 nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC's Chip-on-Wafer-on-

Semiconductors | 01-08-2024

Connectivity for high-performance compute and AI infrastructure

Alphawave Semi has announced a 9.2Gbps HBM3E subsystem (PHY + Controller IP) silicon platform. Based on the company's proven HBM3E IP, the platform takes chiplet-enabled memory ban

Industrial | 26-06-2024

Off-the-shelf chiplet for HPC and AI iinfrastructure

Alphawave Semi has announced the successful tape-out of the industry's first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC's 7nm process. Aggregating the company's

Semiconductors | 20-06-2024