Sarcina Technology has launched its innovative AI platform to facilitate advanced AI packaging solutions that can be tailored to meet specific customer requirements. Employing ASE's FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly te

Sarcina Technology | 01-04-2025

X-FAB Silicon Foundries SE, SMART Photonics, and Epiphany Design are collaborating to develop a new heterogeneous photonics integration platform that combines the strengths of InP and SOI technologies, enabling multi-terabit data rates for

X-FAB | 01-04-2025

The Bourns CDSOT23-SM712 is a compact, high-performance ESD protection diode that safeguards sensitive electronic components against ESD and transient voltage surges. This device is available now from WIN SOURCE. As an essential component i

WIN SOURCE | 31-03-2025

Mouser Electronics, Inc. now stocks the nRF9151 low-power cellular SiP from Nordic Semiconductor. The fully integrated, pre-certified SiP delivers unmatched performance and versatility using low-power LTE technology, advanced processing, an

Mouser Electronics | 28-03-2025

Renesas Electronics Corporation has released a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm M0+ MCU, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-quali

Renesas | 28-03-2025

Nexperia has released an AEC-Q100-qualified 12-channel, 40V high-side LED driver IC that complies with the ASIL-B level for designing functionally safe automotive lighting, including tail, brake, signal and in-cabin illumination application

Nexperia | 28-03-2025

As the industry embraces digital transformation and the principles of Industry 4.0, communication protocols in industrial automation are becoming more essential than ever. To facilitate seamless data exchange and control in automation syste

Infineon | 27-03-2025

The XC3S50AN-4TQG144C, available now from WIN SOURCE stands out as a robust and highly adaptable FPGA designed to cater to diverse needs in embedded systems and electronic designs. As part of Xilinx's Spartan-3AN family, this FPGA combines

WIN SOURCE | 27-03-2025

Mouser Electronics, Inc. now offers the new SiWx917Y wireless modules from Silicon Labs. The wireless modules provide ultra-low-power Wi-Fi 6, BLE 5.4, and Matter connectivity for a host of embedded, battery-powered IoT devices in smart hom

Mouser Electronics | 26-03-2025

Following the launch of the industry's first PFC and hybrid flyback (HFB) combo IC, Infineon Technologies AG introduces the E-version of its hybrid flyback controller family. Developed for high-performance applications, the new XDP hybrid f

Infineon | 25-03-2025

Nexperia has introduced a range of highly efficient and robust industrial grade 1200V SiC MOSFETs with industry-leading temperature stability in innovative surface-mount (SMD) top-side cooled packaging technology called X.PAK. This package,

Nexperia | 25-03-2025

To assist engineers in meeting stringent safety requirements while minimising design costs and complexity, Microchip Technology has released the AVR SD family of MCUs. The MCUs feature built-in functional safety mechanisms and are designed

Microchip Technology | 25-03-2025

Nexperia has added 12 new devices to its continuously expanding e-mode GaN FET portfolio. This latest release is intended to meet the growing demand for higher efficiency and more compact systems. The new low and high-voltage e-mode GaN FET

Nexperia | 24-03-2025

Power Integrations has announced TinySwitch-5, extending the output power of the most popular family of integrated off-line switcher ICs to 175W. The new device achieves up to 92% efficiency using basic diode rectification and optocoupler f

Power Integrations | 24-03-2025