Automakers are revolutionising the driving experience with innovative smart cockpit designs that feature large displays and emerging technologies like OLEDs and microLEDs, seamlessly blending functionality with brand identity. However, thes

Microchip Technology | 26-02-2025

Texas Instruments has announced a new family of radiation-hardened and radiation-tolerant half-bridge GaN FET gate drivers. This family of gate drivers incorporates the industry's first space-grade GaN FET driver that supports up to 200V op

Texas Instruments | 25-02-2025

SemiQ Inc. has announced a family of three 1200V SiC full-bridge modules, each incorporating two of the company's rugged high-speed switching SiC MOSFETs with reliable body diode. The modules have been designed to simplify the developmen

SemiQ | 25-02-2025

Mouser Electronics, Inc. has announced a new eBook in collaboration with NXP Semiconductors, exploring how the electrification of systems, including industrial and automotive, relies heavily on advances and innovation in motor control techn

Mouser Electronics | 24-02-2025

GaN technology plays a crucial role in enabling power electronics to reach the highest performance levels. However, GaN suppliers have taken different approaches to package types and sizes, leading to fragmentation and a lack of multiple fo

Infineon | 24-02-2025

ADLINK Technology Inc. has launched the new OSM-MTK510. It is an OSM R1.1 Size-L with a 662 BGA module powered by the MediaTek Genio 510 series processor. The newest OSM solution is engineered for efficiency and excels in comprehensive AI w

Adlink | 21-02-2025

Infineon Technologies AG has made considerable progress on its 200mm SiC roadmap. The company will release the first products based on the advanced 200mm SiC technology to customers in Q1 2025. The products, manufactured in Villach, Austria

Infineon | 20-02-2025

Alliance Memory will showcase its expanded portfolio, including a new 32Mb fast SRAM, DDR4 and LPDDR4X SDRAMs, and high-density serial NOR Flash devices at Embedded World 2025. The company has expanded its fast CMOS SRAMs with a new 32Mb

Alliance Memory | 20-02-2025

ROHM has developed bidirectional TVS diodes compatible with CAN FD high-speed in-vehicle communication. Such protocols are seeing an increased demand in line with the ongoing advancement in autonomous driving and ADAS. CAN FD is a crucial c

ROHM Semiconductor | 20-02-2025

Advantech has unveiled its latest AI acceleration modules, the EAI-1200 and EAI-3300, powered by Hailo-8 AI processors. These modules supply AI performance of up to 52 TOPS while achieving more than 12 times the power efficiency of comparab

Advantech | 18-02-2025

Nexperia has released the industry's first ESD protection diodes to comply with the OPEN Alliance requirements for use in 10BASE-T1S automotive Ethernet applications. These diodes' exceptionally low capacitance (0.4 pF) means they can also

Nexperia | 17-02-2025

SemiQ Inc. has released the QSiC 1200V MOSFET, a third-generation SiC device that reduces the die size while improving switching speeds and efficiency. The device is 20% smaller than the company's second-generation SiC MOSFETs and has be

SemiQ | 17-02-2025

Toshiba Electronics Europe GmbH improves motor control solutions by releasing two single-channel H-bridge drivers for brushed DC motors. These new drivers, TB67H453FNG and TB67H453FTG, feature maximum motor output ratings of 50V and 3.5A, e

Toshiba | 14-02-2025

u-blox has expanded its portfolio with six new variants of the NORA-B2 BLE modules. Now integrating the complete range of Nordic Semiconductor's next-level nRF54L Series of ultra-low power wireless SoCs, NORA-B2 provides a versatile solutio

U-Blox | 12-02-2025