Mouser has agreed on the global distribution with Telink Semiconductor for a range of SoCs, starter kits, and multi-protocol IoT solutions. The Telink TLSR827x series provides ultra-low-power, concurrent, multi-protocol IoT solutions at
Mouser Electronics | 19-07-2021
MikroElektronika (MIKROE) has launched FUSION for PIC v8, providing universal support for PIC, dsPIC, PIC24, PIC32 microcontrollers on one board. FUSION development boards are excellent for rapid prototyping and are furnished with everythin
Mikroelektronika | 19-07-2021
Cadence Design Systems and United Microelectronics Corporation announced that the Cadence digital full flow has been optimised and certified for the UMC 22ULP/ULL process technologies to speed consumer, 5G and automotive application design.
Cadence | 16-07-2021
With its release of development tools for RISC-V processors, IAR Systems supports the ISO 26262 ASIL-D ready certified RISC-V processor core 'EMSA5-FS' of the Fraunhofer Institute for Photonic Microsystems IPMS. Users of the toolchain softw
Fraunhofer | 15-07-2021
SEGGER Microcontroller collaborates with Analog Devices, providing embedded engineers with a new solution for developing industrial Ethernet applications, including the new Ethernet-APL standard. The collaboration between the two compani
Segger | 15-07-2021
Imperas Software has announced that Andes Technology has certified the Imperas reference models for the entire range of Andes IP cores with the new RISC-V P extension. Developers may now employ the Imperas reference models to evaluate multi
Imperas Software | 15-07-2021
The WPC has released the Qi 1.3 specification that needs authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver. To satisfy the demands of the specification, Microchip Technology offe
Microchip Technology | 15-07-2021
U-blox has introduced a set of Wi-Fi 5, Wi-Fi 6, and Bluetooth expansion cards that plug into NXP Semiconductors’ i.MX processor evaluation kits. The cards, which adhere to the M.2 form factor, connect u-blox modules powered by wireless SoC
U-Blox | 14-07-2021
RS Components has signed an agreement with LEGO Education as an authorised reseller of LEGO Education products in the UK. This collaboration signals the company’s increased commitment to providing STEM education technology in the classroom
RS Components | 13-07-2021
Aldec, Inc has extended its TySOM family of embedded prototyping boards with the new TySOM-M-MPFS250, the first in a planned series to feature a Microchip PolarFire SoC FPGA MPFS250T-FCG1152 and to possess dual FMC connectivity. Microchi
Aldec | 13-07-2021
Renesas Electronics Corporation has launched an innovative new IoT system design platform, significantly easing the prototyping of IoT systems. The Renesas Quick-Connect IoT system comprises standardised boards and interfaces, allowing desi
Renesas | 12-07-2021
U-blox announces the launch of its new PointPerfect location service. The new service provides an advanced GNSS augmentation data service created from the ground up to be ultra-accurate, ultra-reliable, and available immediately. The servic
U-Blox | 09-07-2021
POS (point of sale terminals) are not sufficiently protected against physical attacks. Attackers may access sensitive data (such as credit card numbers and PIN codes) employing probes or mini-drills. An added security element in the securit
Harting Ltd | 09-07-2021
Melexis has launched a free online simulation tool for magnetic sensor evaluation and module design. The tool provides customers’ engineering teams with the capability to design and simulate their own magnets based on the company's Triaxis
Melexis | 08-07-2021
