Boards


High-efficiency DC-DC converter evaluation board for fast charger designs

Silanna Semiconductor offers an evaluation board that will aid engineers in quickly building and testing 100W end-to-end fast charger applications constructed around the company's CO2 Smart Power family of wide-voltage, high-frequency POL c

Silanna Semiconductor | 15-08-2023

PCBs minimise electronic waste and carbon footprint of demo and evaluation boards

Infineon Technologies AG is taking another important step towards a greener future by introducing Soluboard, a recyclable and biodegradable PCB substrate based on natural fibres and a halogen-free polymer. UK start-up Jiva Materials develop

Infineon | 07-08-2023

AI accelerator portfolio delivers unprecedented performance to edge AI applications

Hailo has expanded its groundbreaking Hailo-8 AI accelerator range following hundreds of successful deployments in customer programs and products. The new high-performance Hailo-8 Century PCIe card line delivers up to 208 TOPS for most dema

Hailo | 07-08-2023

Embedded boards and systems feature AMD-processors

EEPD provide the newest generation of embedded NUC series boards and systems based on the latest AMD Ryzen mobile processors and is offered in a wide range of variants. Constructed in Germany, compact, powerful and scalable, the embedded NU

EEPD | 04-08-2023

Rugged tablet redefines durability and performance

AAEON's latest innovation, the RTC-1020 rugged tablet, is now available through Display Technology. Developed to deliver unparalleled utility and performance, the tablet sets new standards in rugged computing, supplying outstanding certific

Display Technology | 04-08-2023

High AI performance in a tiny rugged fanless industrial PC

SolidRun has released what is claimed to be the world's first rugged system design that combines eight-core AMD Ryzen 7040 series processors with multiple Hailo-8 AI accelerators to produce its Bedrock R7000 Edge AI for AI applications. Thi

SolidRun | 02-08-2023

New light curable adhesives for wearable consumer electronics

Intertronics has introduced the Dymax 9200-W Series of next-generation light curable encapsulants and structural and optical-positioning adhesives. The range is created with low-sensitising ingredients for products that are touching, or nea

Intertronics | 01-08-2023

Cybersecurity-enabled board ideal for high performing applications

Aitech Systems has stated that its SOSA-aligned U-C8500 3U VPX SBC has passed environmental qualification testing. Aligned with The Open Group SOSA Technical Standard, its U-C8500 is based on Intel's ground-breaking SWaP-C optimised Tige

Aitech | 01-08-2023

Company provides NUC business continuity

Impulse Embedded has assured its customers that Intel, who recently announced that they would be exiting the business of complete PC systems, including NUC mini-PCs and kits, is not necessarily a cause for concern. While Intel will be endin

Impulse Embedded | 31-07-2023

Full kitting service provides a single supplier solution for a full BOM

Agile Electronics can offer customers a full electronic component kitting service. The company provides customers with a single supplier solution enabling their complete BOM to be loaded into its system as a single line item. This has the a

Agile Electronics | 31-07-2023

Collaboration accelerates automotive motor control development

Toshiba Electronics Europe GmbH has collaborated with MikroElektronika to incorporate its TB9053 DC-motor driver IC into the DC Motor 26 Click Board to speed up the development of automotive applications. The device supplies a dual H-bri

Toshiba | 31-07-2023

Component libraries on GitHub speed up design process

Würth Elektronik now provides a comprehensive components library for Altium designers on GitHub. The ready-for-use component models and detailed data spare designers the exertion of having to compile models of components themselves for use

Wurth | 31-07-2023

New serial transceiver products for simplifying sensing and control systems

THine Electronics, Inc has released its new serial transceiver products, THCS253 and THCS254, that allow systems with many peripheral sensors to simplify cabling for the sensor and control functions. These products facilitate system cost, s

THine Electronics | 25-07-2023

One-part toughened epoxy for dam-and-fill encapsulation

Master Bond Supreme 3DM-85 is a no-mix, non-solvent-based, one-component epoxy. This thixotropic paste material was formulated as the damming compound in dam-and-fill encapsulation applications. It can also be employed for bonding and seali

Masterbond | 24-07-2023

Articles