Concurrent Technologies has launched Iris, a dual enclave switch card. The company will market it as a plug-in-card (PIC) to other system integrators and use it as the basis for its own system-level products. Iris is the system keystone

Concurrent | 23-08-2023

Master Bond EP40TCMed is a two-part, room-temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically non-conductive and can be used as an adhesive or sealant in

Masterbond | 15-08-2023

Silanna Semiconductor offers an evaluation board that will aid engineers in quickly building and testing 100W end-to-end fast charger applications constructed around the company's CO2 Smart Power family of wide-voltage, high-frequency POL c

Silanna Semiconductor | 15-08-2023

Infineon Technologies AG is taking another important step towards a greener future by introducing Soluboard, a recyclable and biodegradable PCB substrate based on natural fibres and a halogen-free polymer. UK start-up Jiva Materials develop

Infineon | 07-08-2023

Hailo has expanded its groundbreaking Hailo-8 AI accelerator range following hundreds of successful deployments in customer programs and products. The new high-performance Hailo-8 Century PCIe card line delivers up to 208 TOPS for most dema

Hailo | 07-08-2023

EEPD provide the newest generation of embedded NUC series boards and systems based on the latest AMD Ryzen mobile processors and is offered in a wide range of variants. Constructed in Germany, compact, powerful and scalable, the embedded NU

EEPD | 04-08-2023

AAEON's latest innovation, the RTC-1020 rugged tablet, is now available through Display Technology. Developed to deliver unparalleled utility and performance, the tablet sets new standards in rugged computing, supplying outstanding certific

Display Technology | 04-08-2023

SolidRun has released what is claimed to be the world's first rugged system design that combines eight-core AMD Ryzen 7040 series processors with multiple Hailo-8 AI accelerators to produce its Bedrock R7000 Edge AI for AI applications. Thi

SolidRun | 02-08-2023

Intertronics has introduced the Dymax 9200-W Series of next-generation light curable encapsulants and structural and optical-positioning adhesives. The range is created with low-sensitising ingredients for products that are touching, or nea

Intertronics | 01-08-2023

Aitech Systems has stated that its SOSA-aligned U-C8500 3U VPX SBC has passed environmental qualification testing. Aligned with The Open Group SOSA Technical Standard, its U-C8500 is based on Intel's ground-breaking SWaP-C optimised Tige

Aitech | 01-08-2023

Impulse Embedded has assured its customers that Intel, who recently announced that they would be exiting the business of complete PC systems, including NUC mini-PCs and kits, is not necessarily a cause for concern. While Intel will be endin

Impulse Embedded | 31-07-2023

Agile Electronics can offer customers a full electronic component kitting service. The company provides customers with a single supplier solution enabling their complete BOM to be loaded into its system as a single line item. This has the a

Agile Electronics | 31-07-2023

Toshiba Electronics Europe GmbH has collaborated with MikroElektronika to incorporate its TB9053 DC-motor driver IC into the DC Motor 26 Click Board to speed up the development of automotive applications. The device supplies a dual H-bri

Toshiba | 31-07-2023

Würth Elektronik now provides a comprehensive components library for Altium designers on GitHub. The ready-for-use component models and detailed data spare designers the exertion of having to compile models of components themselves for use

Wurth | 31-07-2023