Subs & Systems

Authenticators for medical device protection enable engineers to add extra protection to applications

24-05-2019 | Mouser Electronics

New FPGA enhances security with hardware root-of-trust capabilities

23-05-2019 | Lattice Semiconductor Ltd

Ultra-thin piezo speaker offers a wide dynamic range

23-05-2019 | TDK

Cross line and point red laser for use in bright lighting, long distances or outdoors

22-05-2019 | RS Components

UHF RFID modules ideal for challenging applications

22-05-2019 | Mouser Electronics

New cleanroom facility for UK aerospace and defence surface mount oscillator production

22-05-2019 | Euroquartz

Contactor offers significant size, weight and performance advantages

21-05-2019 | TTI Europe

Thermal cooling configuration provides next-generation solutions

21-05-2019 | Molex

Lens array with mirror developed for optical transceivers

21-05-2019 | Alps

Ultra-low-power Bluetooth Low Energy 5 module is a compact solution for IoT

20-05-2019 | Mouser Electronics

Epoxy thermal conductive adhesive is ideal for bonding heat sinks and other heat-generating components

20-05-2019 | RS Components

Expanded carrier-grade time and synchronisation portfolio solves network deployment and scalability challenges

17-05-2019 | Microchip Technology

GaN-on-Silicon monolithic full HD microLED bonded displays available now

17-05-2019 | Plessey

System memory solution released for new MPU series

17-05-2019 | Rutronik

Insights articles
DLP vs. LCD vs. LED vs. LCoS vs. Laser: Shedding Light on Projector Technology

25-06-2019 | By Moe Long

Low power photonic chip uses light instead of electricity

24-06-2019 | By Rob Coppinger

Nanotube forests could lead to stretchable supercapacitors

20-06-2019 | By Rob Coppinger

EDA vendors upgrade their offerings

19-06-2019 | By Nnamdi Anyadike