Subs & Systems

Ultra-small high-performance Bluetooth 5.0 module added to portfolio

20-12-2019 | U-Blox

Highly adaptable board level shielding can increase layout possibilities

20-12-2019 | Harwin

New RF front end released for mMIMO designs

19-12-2019 | Analog Devices

Cost-effective and powerful development board loaded with peripherals

19-12-2019 | Digilent

New data storage solution targets high-performance computing applications

17-12-2019 | Aldec

New specialist adhesive ideal for chip bonding

17-12-2019 | Inseto (UK) Ltd

New evolution of core alignment fusion splicer launched

13-12-2019 | Fujikura

Giving customers reduced time to market and high product quality

13-12-2019 | Verotec

New flanged enclosures for sensor electronics

12-12-2019 | OKW Enclosures

Cat6 angled patch cables for tight-fit and dense connectivity applications

12-12-2019 | ShowMeCables

Added features and improved user interface in free-to-use CAD software

11-12-2019 | RS Components

3D printer gives constant high speed and accuracy

10-12-2019 | RS Components

Coaxial adapter expansion bridges technology gap

10-12-2019 | Amphenol

Fast common mode filters with integrated ESD protection for Super Speed USB

10-12-2019 | Nexperia

Insights articles
Four Things to Know about Railguns

23-01-2020 | By Gary Elinoff

How Sci-Fi Influences Real-World Tech and Innovation

22-01-2020 | By Moe Long

Could Silicon Anodes Be Made More Stable?

21-01-2020 | By Liam Critchey

Self-Healing Thermoelectric Material for Wearables

20-01-2020 | By Philip Spurgeon