Indium Corporation will showcase products from its GalliTHERM portfolio of gallium-based liquid metal solutions at SEMICON Taiwan. This innovative product line draws on the company's experience in manufacturing gallium-based liquid metals. It also provides significant global technical support to support customers in ensuring their liquid metal thermal solutions fulfil their application requirements with low- and high-volume production available in the US and Asia.
It offers several innovative high-performance metal TIM solutions. With its portfolio of liquid alloys at or near room temperature, the company's liquid metal TIMs are created to provide excellent thermal conductivity for TIM1 and TIM2 applications.
The company's m2TIM combines liquid metal with a solid metal preform to offer reliable thermal conductivity for heat dissipation without requiring a solderable surface. The presence of a solid solder preform absorbs and contains the liquid alloys while enhancing thermal conductivity.
Offered in InGa and InGaSn, this hybrid approach provides outstanding wetting ability to metallic and non-metallic surfaces and low interfacial resistance. It also lowers the risk of pump-out of the liquid alloy.
It will also feature the first no-clean, ball-attach flux on the market, NC-809. This dual-purpose flux is engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications. This material is created to hold die or solder spheres in place without risk of die shift or solder sphere movement throughout the assembly process.
SEMICON Taiwan, booth #J2456, September 14-16, Taipei, Taiwan.