SHENMAO America, Inc supplies PF606-P269J Lead-Free Jetting Solder Paste specifically developed for the jetting process. It delivers excellent workability and solderability for automatic high-speed jetting production with exceptional accuracy and precision.
Jet dispensing can greatly improve production speeds compared to contact dispensing by eradicating the necessity for Z-axis movement. Jet dispensing also makes it simpler to deposit solder paste onto surfaces of differing heights.
PF606-P269J is halogen-free (ROL0) and complies with RoHS 2.0 and REACH. The new paste is formulated with the SAC305 Alloy, and powder size ranges from type 4 to type 7 for fine dot jetting. It is appropriate for fine pitch and ultra-fine pitch applications and devices with uneven cavities and other difficult-to-print locations.
Dot volume, size and shape are straightforward to adjust and optimise for each component and pad on the board by utilising the jetting system, making it suitable for fine-pitch devices and minimising the failure rate in production.