Toshiba Electronics Europe GmbH has launched the TLX9165T, an automotive photorelay in a 10-pin SO16L-T package, that achieves an output withstand voltage of 1800V (min.). It is developed specifically to support the BMS for high-voltage, 80

Toshiba | 05-08-2025

Texas Instruments has introduced new single-chip battery fuel gauges with first-of-its-kind adaptive Dynamic Z-Track technology for more efficient, reliable operation in battery-powered devices. Compared to conventional gauging methods, the

Texas Instruments | 04-08-2025

Bosch has introduced two new system-on-chips. The SX600 and the SX601 support a wide range of ADAS functions that fall under SAE level 2+ for vehicle autonomy. For example, the automatic emergency braking function lowers the risk of rear-en

Bosch | 04-08-2025

Vishay Intertechnology, Inc. has introduced a new series of uni/bidirectional 1500W surface-mount PAR TVS in the SMB (DO-214AA) package. To satisfy the demands of automotive applications, the Vishay General Semiconductor T15BxxA and T15BxxC

Vishay Intertechnology | 04-08-2025

Toshiba Electronics Europe GmbH has extended its lineup to control 1A and 6A class gate drive currents for small to medium-capacity MOSFET and IGBT gate drives. The TLP579xH series fulfils the growing demand for gate drivers that drive high

Toshiba | 01-08-2025

Littelfuse, Inc. has launched the Pxxx0S3H SIDACtor Protection Thyristor Series, the industry’s first 2kA surge protection component in a DO-214AB (SMC) package. This compact solution provides robust defence against severe transient events

Littelfuse | 01-08-2025

Magnachip Semiconductor Corporation has released a new 80V MXT MV MOSFET, MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package. The company has already begun supplying the new MOSFET to a leading global electric motor manufa

MagnaChip | 31-07-2025

Infineon Technologies AG has released the CoolSiC MOSFETs 1200V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency, and power density. They were specifically designed for d

Infineon | 31-07-2025

Mouser Electronics, Inc., announced a new eBook in collaboration with Texas Instruments (TI). In this eBook, 13 industry experts explore how AMRs are redefining industries from warehousing to manufacturing and industrial automation. AMRs

Mouser Electronics | 30-07-2025

TDK Corporation offers a variety of new large-size ferrite cores with different core shapes, making this the industry's largest lineup of shapes, sizes, and materials for such large cores. These are employed in a wide range of industrial ap

TDK | 30-07-2025

onsemi announced an expanded collaboration with Schaeffler through a new design win that uses onsemi’s next-generation EliteSiC product line of SiC MOSFETs. The onsemi solution will power the Schaeffler traction inverter for a leading globa

onsemi | 30-07-2025

Vector has expanded its proven development and test environment CANoe to include support for the communication standard DDS (Data Distribution Service). CANoe.DDS permits users to simulate, analyse, and test DDS-based systems seamlessly wit

Vector | 30-07-2025

The Texas Instruments TPSM336xx-Q1 is a 0.6A, 1A, or 2A, 36V input, automotive synchronous step-down DC-DC power module that combines flip-chip on lead packaging, integrated power MOSFETs, an AEC-Q200-qualified inductor, and a boot capacito

Texas Instruments | 29-07-2025

Cincoze’s MXM GPU computer series (GM-1100) offers high performance, a compact design, and expansion flexibility, making it an excellent choice for space-constrained Edge AI applications. The series supports the latest 14th Gen Intel Core p

Cincoze | 29-07-2025