Latest News


Third-generation SiC MOSFET cuts size while improving performance

SemiQ Inc. has released the QSiC 1200V MOSFET, a third-generation SiC device that reduces the die size while improving switching speeds and efficiency. The device is 20% smaller than the company's second-generation SiC MOSFETs and has be

SemiQ | Power | 17-02-2025

Industry’s smallest wire-to-board crimp connector

Hirose has expanded its SignalBee connector platform to include a smaller wire-to-board version. With a height of 1.45mm and a depth of 3.55mm, the new DF53 Series connector is the industry’s smallest 0.6mm crimp connector available on the

Hirose | Industrial | 17-02-2025

SOMs for high-performance computing

Mouser Electronics, Inc. now stocks the iW-RainboW-G36M Zynq Ultrascale+ SOM from iWave Systems. The iW-RainboW-G36M SOMs meet the functional needs of high-performance embedded applications, including automotive systems, AI and ML, industri

Mouser Electronics | Industrial | 14-02-2025

Automotive-grade shielded power inductor series expanded

Bourns, Inc. has announced its new Model SRR6838A Series Shielded Power Inductors. Bourns’ new AEC-Q200 compliant, automotive-grade power inductors give designers of high-reliability consumer, industrial and telecom applications an expanded

Bourns | Passives | 14-02-2025

EMI suppression capacitors offer size reduction and improved humidity resistance

TDK Corporation has launched the EPCOS B3292xM3/N3 series of X2 EMI suppression capacitors. These new components are 20% smaller than previous models and meet Grade III Test B standards for temperature, humidity, and bias (THB). Their compa

TDK | Passives | 14-02-2025

SMPS spring bullets provide enhanced density and support high-frequency applications

SV Microwave's newest spring-loaded bullet product line features an SMPS RF interface, improving density and supporting high-frequency applications up to 32GHz. These bullets are engineered for consistent RF performance, regardless of the c

SV Microwave | Industrial | 14-02-2025

Boost efficiency and expand possibilities with advanced H-bridge drivers

Toshiba Electronics Europe GmbH improves motor control solutions by releasing two single-channel H-bridge drivers for brushed DC motors. These new drivers, TB67H453FNG and TB67H453FTG, feature maximum motor output ratings of 50V and 3.5A, e

Toshiba | Power | 14-02-2025

Evaluation platform showcases innovative compute accelerator technology

VyperCore has launched VyperLab, a new cloud-based evaluation platform for its groundbreaking technology. The platform allows Lead Partners to explore the power of its hardware accelerator innovation, providing significant energy savings, i

VyperCore | Test & Measurement | 14-02-2025

New range of AC/DC power supplies offers compact and low-profile

XP Power has released the CCR range of compact, low-profile (25.4mm) AC/DC power supplies with flexible cooling options and power ratings from 110W to 420W, enabling more efficient use of space within the end equipment. Approved for use in

XP Power | Power | 14-02-2025

dToF sensor suited to home and industrial robotic applications

Mouser Electronics, Inc. now stocks the TMF8806 dToF Sensor from ams OSRAM. The device is a dToF optical distance sensor module attaining up to 5000mm target detection distance. It can operate at ultra-low power consumption using ultra-l

Mouser Electronics | Test & Measurement | 13-02-2025

Robust seven-slot SOSA aligned backplane offers cutting-edge interconnect technology

Elma Electronic has improved its line of SOSA-aligned backplanes to include a seven-slot 3U OpenVPX model that further supports the DOD’s Modular Open Systems Approach (MOSA) mandate. Complete with six VITA 65 slots and one VITA 62 PSU s

Elma Electronics | Industrial | 13-02-2025

New industrial embedded AI box available now

Advantech has released its EPC-R7300 Orin Nano Super, an industrial embedded AI box PC featuring the NVIDIA Jetson Orin Nano 8GB SoM. Employing the powerful NVIDIA Jetson Orin platform, the EPC-R7300 delivers up to 67 TOPS of AI performance

Advantech | Industrial | 13-02-2025

Providing enhanced adhesion for low surface energy materials

To assist manufacturers, address the rising demand for bonding low surface energy (LSE) materials, such as polypropylene and polyethylene, Intertronics presents SCIGRIP SG400LSE Methyl Methacrylate Adhesive (MMA). SG400LSE helps eradicate t

Intertronics | Automotive & Transport | 13-02-2025

Automotive grade high voltage thin film chips add 10ppm and 15ppm TCR options

Stackpole Electronics Inc. has extended its RNCV series of automotive-grade high voltage thin film chip resistors to include 10ppm and 15ppm TCR options. These resistors are designed for high-voltage applications demanding high accuracy for

Stackpole | Passives | 13-02-2025