Toshiba


New high-current photorelays for factory automation

Toshiba Electronics Europe has five new high-current photorelays in DIP4 and DIP6 packages. These additions to its photorelay portfolio incorporate MOSFETs fabricated with the late

Products | 28-03-2018

New line-up of SSDs optimised for data centre applications

Toshiba Memory Europe has added to its portfolio of SSDs for the data centre a new line-up of 3D flash memory-based PCI Express NVMe and SATA SSDs in multiple form factors. The new

Subs & Systems | 23-03-2018

Power amplifier IC adopting pure MOS for car audio in surface-mount package

Toshiba Electronics Europe offers a new high sound quality, low distortion, surface mount four-channel power ICs for automotive applications. The new TCB001FNG is based on a pure c

Products | 19-02-2018

New N-channel power MOSFETs for industrial applications

Toshiba Electronics Europe is shipping two new 100V additions to its low-voltage U-MOS IX-H N-channel power MOSFET series. The new devices are perfectly suited to power supply appl

Products | 12-02-2018

New LDO regulator ICs suitable for IoT applications

Toshiba Electronics Europe has released the TCR3UG series of small package, LDO regulators with an output current of 300mA. The devices are suitable for power management of wearabl

Products | 24-01-2018

Integrated controllers boost read and write speeds in embedded flash memory

Toshiba Electronics Europe has launched new e•MMC[1] and UFS NAND flash embedded memories that use enhanced integrated controller technologies to deliver significant read and write

Products | 27-10-2016

New small-package 60W and 100V automotive N-channel MOSFETs

Toshiba Electronics Europe has announced two new compact, N-channel MOSFETs for load switching in automotive applications. The 60V SSM3K341R and the 100V SSM3K361R deliver class le

Products | 09-09-2016

World’s first sample shipment of 64-Layer 3D flash memory

Toshiba has unveiled the latest generation of its BiCS FLASH three-dimensional (3D) flash memory with a stacked cell structure[1], a 64-layer device that will be first (as of July

New Technologies | 28-07-2016

Implementation system adopted for memory controller production design project

Cadence Design Systems has announced that Toshiba Corporation has adopted the Cadence Innovus Implementation System for its memory controller's production design project. The tool

Design Applications | 27-04-2016

Read-intensive enterprise solid-state drives offer maximum application scalability

Toshiba Electronics Europe has announced the availability of a new 'very read-intensive', enterprise SAS solid state drive (SSD) – The PX04SL Series is optimised for read-intensive

Subs & Systems | 19-01-2016

Ethernet bridge solution for automotive applications

Toshiba Electronics Europe has introduced a new automotive-grade Ethernet bridge solution for in-vehicle infotainment (IVI) and other automotive applications. The TC9560XBG suppo

Products | 08-01-2016

GaN-on-Si high-power white LEDs for domestic and public applications

Four new products have been introduced by Toshiba Electronics Europe expanding its TL1L4 series of white LEDs. The new additions provide a high luminous flux and are suited to appl

Connectors, Switches & EMECH | 14-09-2015

Highest capacity HDDs designed for cloud-based bulk storage systems

Toshiba Electronics Europe has announced a new, high-capacity addition to its MC04 Series HDDs. The new 6TB version of the MC04 Series of enterprise high-capacity HDDs is designed

Products | 30-06-2015

World’s first 48-layer BiCS (three-dimensional stacked structure flash memory)

Toshiba has announced the development of the world’s first 48-layer three dimensional stacked cell structure flash memory. Sample shipments of 'BiCS', a 2-bit-per-cell 128-gigabi

New Technologies | 27-03-2015