KIOXIA Europe GmbH is participating in the HPE Spaceborne Computer-2 (SBC-2) program, which uses KIOXIA SSDs to supply robust flash storage in HPE Edgeline and HPE ProLiant servers

Semiconductors | 02-03-2023

KIOXIA Europe GmbH today announced that it has begun sampling the latest generation of its JEDEC e-MMC Ver. 5.1-compliant embedded flash memory products for consumer applications.

Semiconductors | 01-09-2022

KIOXIA Europe GmbH is sampling new industrial-grade flash memory devices. This new lineup uses its latest generation BiCS FLASH 3D flash memory with 3-bit-per-cell (triple-level ce

Semiconductors | 18-08-2022

KIOXIA Europe GmbH now offers a sampling of the industry’s first XFM Ver.1.0-compliant removable PCIe attached, NVMe storage device of 256GB and 512GB: the XFMEXPRESS XT2. With the

Semiconductors | 17-06-2022

KIOXIA Europe GmbH has started sampling new Automotive UFS Ver. 3.1 embedded flash memory devices. The new line-up uses the company’s BiCS FLASH 3D flash memory and is available in

Automotive & Transport | 04-04-2022

KIOXIA Europe GmbH announces that the sampling of the industry’s first UFS embedded flash memory devices supporting MIPI M-PHY v5.0 has begun. The new line-up uses the company’s Bi

Subs & Systems | 02-03-2022

Kioxia Europe GmbH has released the UFS Ver. 3.1 embedded flash memory devices using its innovative 4-bit per cell quad-level-cell technology. For applications requiring high densi

Semiconductors | 26-01-2022

KIOXIA Europe GmbH now offers production-ready availability of its 9.5mm XD6 Series Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S data centre class SSDs. Launched in

Subs & Systems | 17-11-2021

KIOXIA Europe GmbH offers what it claims to be the industry’s first line-up of Enterprise and Data Center Standard Form Factor (EDSFF) E3.S SSDs designed with PCIe 5.0 technology.

Subs & Systems | 15-11-2021

KIOXIA Europe GmbH offers sampling of its 1TB UFS Ver. 3.1 embedded flash memory devices. Contained in a 1.1mm-high package – claiming to make it the thinnest 1TB UFS available – t

Semiconductors | 11-03-2021

KIOXIA Europe has announced that it has successfully developed its fifth-generation BiCS FLASH 3D flash memory with a 112-layer vertically stacked structure. The new device has a 5

Semiconductors | 06-02-2020

KIOXIA Europe has begun sampling the industry’s first 512GB Automotive UFS JEDEC Version 2.1 embedded memory solution. This automotive UFS supports a broad temperature range (-40C

Automotive & Transport | 18-11-2019