KIOXIA Europe GmbH is sampling new industrial-grade flash memory devices. This new lineup uses its latest generation BiCS FLASH 3D flash memory with 3-bit-per-cell (triple-level cell, TLC) technology and is offered in a 132-BGA package. Densities range from 64GB to 512GB to support the unique needs of industrial applications - including telecommunication, networking, embedded computing and much more.
The memory demands for many industrial applications stand in stark contrast to those of SSDs created to be housed in climate-controlled data centres – including the requirement for extended temperature ranges and the capability to sustain high reliability and performance in rugged operating conditions. Created with these conditions in mind, the new devices support a broad temperature range (-40C to +85C).
The devices can convert TLC flash memory (3-bits per cell) to Single-Level Cell (1-bit per cell) mode – enhancing performance and reliability.
“KIOXIA is committed to supporting multiple industrial-grade solutions and accommodating applications that have long life cycles. With the addition of next-generation Industrial Grade BiCS FLASH 3D flash memory, we can now present an efficient and highly reliable embedded memory solution for environments requiring a wider temperature range and increased support for the processor,” said Axel Stoermann, KIOXIA Europe GmbH.