JEDEC XFM Ver.1.0-compliant PCIe/NVMe removable storage device

17-06-2022 | Kioxia | Semiconductors

KIOXIA Europe GmbH now offers a sampling of the industry’s first XFM Ver.1.0-compliant removable PCIe attached, NVMe storage device of 256GB and 512GB: the XFMEXPRESS XT2. With the new XT2 form factor and connector, the device provides an unparalleled combination of options to revolutionise ultra-mobile PCs, IoT devices and multiple embedded applications.

The product is a new form factor for PCIe/NVMe devices. The technology was designed to enhance next-generation mobile and embedded applications by providing a powerful combination of small size, speed and serviceability. It is the first product to meet the specification of the JEDEC standard.

The device allows a new category of small storage devices that are simple to service or upgrade. By pairing a robust, compact package with removable storage functionality and flexibility, it helps diminish technical barriers and design constraints.

The device form factor’s small size and low profile (14mm x 18mm x 1.4mm) provides a 252mm footprint, optimising the mounting space for ultra-compact host devices without sacrificing performance or serviceability. With this minimised z-height, it is excellent for thin and light notebooks. It offers new design possibilities for next-generation applications and systems.

Developed for speed, it implements a PCIe 4.0 x 2 lanes, NVMe 1.4b interface. The performance capabilities and durable form factor offer a compelling alternative to other SSD form factors (such as M.2), allowing superior computing and entertainment experiences.

“Recognising the need for a new class of removable storage, KIOXIA, inventor of flash memory, leveraged its extensive background in single package memory designs to develop the XFMEXPRESS XT2,” comments Axel Stoermann, vice president for Memory Marketing and Engineering, KIOXIA Europe GmbH. ”We are planning to innovate and lead the way forward with more breakthrough storage solutions for complex design challenges in the future.”

Embedded World 2022, booth 3A-117.

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