Embedded flash memory for devices needing high density

26-01-2022 | Kioxia | Semiconductors

Kioxia Europe GmbH has released the UFS Ver. 3.1 embedded flash memory devices using its innovative 4-bit per cell quad-level-cell technology. For applications requiring high density, such as cutting-edge smartphones, the QLC technology offers the ability to fulfil the highest densities available in a single package.


Its UFS PoC device is a 512GB prototype that uses the company's 1TB (128GB) BiCS FLASH 3D flash memory with QLC technology. The PoC device is intended to satisfy mobile applications' increasing performance and density requirements driven by higher resolution images, 5G networks, 4K plus video, and the like.


"Kioxia has been an inventor and leading supplier of UFS memory since 2013. Since that time, we focus on expanding our already broad lineup with new UFS Memory products for applications that demand superior interface performance," noted Axel Stoermann, vice president, Memory Marketing and Engineering, Kioxia Europe GmbH. "With QLC UFS, we can offer another solution which will meet the increasing requirements for Flash memory devices," he continued.

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