SoCs powering the next wave of IoT breakthroughs

Silicon Labs has announced the first products of its Series 3 portfolio, introducing two new wireless SoC families built on the advanced 22nm process node: the SiXG301 and SiXG302. These highly integrated solutions represent a significant leap forward in computing power, integration, security, and energy efficiency, meeting the growing demands of both line-powered and battery-powered IoT devices.

As smart devices grow more sophisticated and compact, the demand for powerful, secure, and highly integrated wireless solutions has never been greater. The new SoCs deliver on this promise with advanced processing capabilities, flexible memory options, best-in-class security, and streamlined integration of external components. The company's Series 1, Series 2, and Series 3 platforms will continue to complement one another in the market, addressing the full breadth of IoT applications.

The new Series 3 families of SoCs include:

SiXG301: Optimised for line-powered applications

Purpose-built for line-powered smart devices, the SiXG301 features an integrated LED pre-driver, providing an ideal solution for advanced LED lighting and smart home products. It supports Bluetooth, Zigbee, and Thread, with compatibility for Matter. Built with high Flash and RAM overhead of 4MB and 512kB, respectively, the device helps future-proof customer designs as the requirements for Matter and other more demanding IoT applications continue to grow. This SoC enables concurrent multiprotocol operation for Zigbee, Bluetooth, and Matter over Thread networks simultaneously, which helps simplify manufacturing SKUs, reduce costs, save board space for additional device integrations, and improve consumer usability. Already in production with select customers, the SiXG301 is slated for general availability in Q3 2025.

SiXG302: Designed for battery-powered efficiency

Expanding Series 3 to battery-powered applications, the upcoming SiXG302 will deliver ground-breaking energy efficiency without sacrificing performance. Featuring the company's advanced power architecture, the device is designed to use only 15µA/MHz active current, 30% lower than competitive devices in its class. This makes it ideal for battery-powered wireless sensors and actuators used in Matter and Bluetooth applications. The device is planned for customer sampling in 2026.

"Smart devices are becoming more complex, and designers are challenged to pack greater functionality into smaller spaces while maintaining energy efficiency," said Ross Sabolcik, senior vice president of Product Lines at Silicon Labs. "With the SiXG301 and upcoming SiXG302 families, we're delivering flexible, highly integrated solutions that enable next-generation IoT devices – whether they're plugged in or running on battery power."

The SiXG301 and SiXG302 families will initially include 'M' devices for multiprotocol, the SiMG301 and SiMG302, and 'B' devices optimised for Bluetooth LE communications, the SiBG301 and SiBG302.

By employing the 22nm process node for all Series 3 devices, Silicon Labs is managing the growing demand for more powerful and efficient far-edge devices across a wide range of IoT applications – from smart cities and industrial automation to healthcare, smart homes, and beyond. These new SoCs offer device makers a scalable, secure platform to create the next wave of innovative, high-performance IoT products.