Semiconductors


medical power supplies, industrial power supply, board mounted dc/dc, medical dc/dc,

Mouser now stocks the i.MX 8M Plus applications processors from NXP Semiconductors. These embedded multi-core heterogeneous applications processors are the first in the i.MX family to integrate a dedicated NPU for advanced machine learning

Mouser Electronics | 17-07-2023

New Gap filler pad offers extremely high thermal conductivity

The Chomerics Division of Parker Hannifin Corporation has released its new THERM-A-GAP PAD 80 high-performance gap filler pad. This innovative product supplies designers of electronics and telecoms devices with a thermal conductivity of 8.3

Parker Chomerics | 17-07-2023

Wi-Fi 6 IC supports wireless protocols for smart home and sensor applications

Mouser now stocks the nRF7002 Wi-Fi 6 companion IC from Nordic Semiconductor. The IC was created to be employed alongside Nordic's existing nRF52 and nRF53 Series BLE SoCs and nRF9160 cellular IoT SiP and a wide range of non-Nordic host dev

Mouser Electronics | 06-07-2023

Motor driver boosts new functions for EVs premiumisation

Melexis has released the MLX81334, a motor driver designed to optimise EV thermal valves (accurate battery temperature control) and expansion valves (heat pump refrigeration loop). This allows a longer range for EVs. The device complements

Melexis | 06-07-2023

Webinar presents PIC and AVR microcontrollers for sensing applications

Mouser has joined with Microchip Technology to deliver the engineering community with a new free webinar titled 'Optimising Sensing Applications with PIC and AVR Microcontrollers'. The webinar will be streamed live at 16:00 CEST on Tuesday,

Mouser Electronics | 05-07-2023

Cost-optimised MCUs provide high-performance analog peripheral integration

Texas Instruments MSPM0L134x and MSPM0L130x MCUs are part of MSP’s highly-integrated, ultra-low-power 32-bit MSPM0 MCU family based on the enhanced Arm Cortex-M0+ core platform functioning at up to 32MHz frequency. These cost-optimised MCUs

Texas Instruments | 04-07-2023

Automotive-qualified MEMS microphone has analog interface for audio and ANC systems

For ANC (Active Noise Cancellation) systems with an analog interface, Infineon Technologies AG extends its automotive microphone portfolio with the XENSIV MEMS microphone IM68A130A with a flat frequency response to frequencies below 10Hz. I

Infineon | 04-07-2023

New dual-band Wi-Fi 6 and dual-mode Bluetooth 5.3 module

u-blox has released the u-blox JODY-W5, its newest module tailored for the automotive market. With its dual-band Wi-Fi 6 and dual-mode Bluetooth 5.3 technologies, including LE Audio, the module is perfect for preventing wireless network con

U-Blox | 04-07-2023

Secure authentication IC offers cryptographic authentication with hardware key storage

Mouser now stocks the Microchip Technology ECC204 secure authentication IC. The IC is a cryptographic authentication device with protected storage for private keys, certificates, symmetric keys, or user data. The hardware-based key storage

Mouser Electronics | 03-07-2023

World’s largest FPGA-based adaptive SoC for emulation and prototyping

AMD has announced the AMD Versal Premium VP1902 adaptive SoC, the world’s largest adaptive SoC. The VP1902 adaptive SoC is an emulation-class, chipset-based device created to streamline the verification of increasingly complex semiconductor

AMD | 03-07-2023

End-to-end positioning system enables accurate and more power-efficient asset tracking

onsemi has released an end-to-end positioning system that allows the simpler and faster development of more accurate, cost- and power-efficient asset tracking solutions. The system is based on the company's RSL15 MCU, the industry's lowest

onsemi | 03-07-2023

New microcontrollers support firmware updates without interrupting operation

Toshiba Electronics Europe GmbH has begun mass production of new microcontrollers (TMPM3HxF10xx) in the M3H group of the TXZ+ Family Advanced Class, manufactured in a 40nm process. In recent years, the necessity for larger program capaci

Toshiba | 30-06-2023

New SiC SBDs offer excellent current carrying and thermal capabilities

Bourns, Inc has released its first 650V-1200V SiC SBDs. The Bourns SiC SBD line comprises six models engineered to deliver excellent current carrying and thermal capabilities and high-power density for increased performance and reliability.

Bourns | 30-06-2023

Exploring the intersection of smart-home tech with Matter protocol

Mouser has released the next instalment of their award-winning Empowering Innovation Together (EIT) series highlighting the Matter protocol. This instalment brings together global technology experts from the CSA and industry-leading manufac

Mouser Electronics | 29-06-2023

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