Unique 2D barcodes increase process ruggedness and reliability

05-10-2023 | Cambridge GaN Devices | Power

Cambridge GaN Devices (CGD) demonstrates its commitment to innovation with another industry first: the inclusion of an individual 2D barcode on a GaN IC, which a standard, commercial code reader can read. This enables CGD to scan packaged devices, identify the circuit and the batch, and learn exactly the whereabouts on each individual die's wafer. This is significant in delivering vital data concerning process ruggedness and reliability.

Zahid Ansari, VP Operations, CGD, commented: "We engineered the incorporation of individual 2D barcodes with our packaging team to give us complete ownership of the process and the ability to resolve any reliability issues. We know, for example, that yields are lowest at the wafer edge – now we can see how the position on the wafer might affect device performance. This information can be fed back to the foundry to enable continuous manufacturing process improvements."

The ability to immediately identify a device using a cheap, commercial barcode reader also has huge implications for speeding up anti-counterfeiting measures, which will greatly interest companies operating in hi-rel fields.

Giorgia Longobardi, CEO, CGD, "Although we have a great deal of data to prove the ruggedness and reliability of our ICeGaN™ HEMTs, GaN is still a relatively new technology, certainly when compared to traditional silicon for power electronics applications. By incorporating 2D barcodes, we are able to provide extremely fast feedback to our manufacturing supply chain, which helps cement our relationships and scale-up for high-volume manufacture."

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.