ROHM has announced the release of new Level 3 (L3) SPICE models, which deliver significantly improved convergence and faster simulation performance. Since power semiconductor losses greatly impact overall system efficiency, simulation ac

ROHM Semiconductor | 14-07-2025

The Texas Instruments TPS546E25W device is a highly integrated, buck Converter with D-CAP4 control topology for fast transient response. All programmable parameters can be configured via the PMBus interface and stored in NVM as new default

Texas Instruments | 14-07-2025

Following the recent release of the updated SMARC Module Specification v2.2, the SGET Standardisation Group has announced the release of the SMARC Design Guide v2.2. This updated version of the Design Guide offers vital support for hardw

SGET Standardisation Group | 14-07-2025

Efficient Power Conversion Corporation (EPC) has released the EPC91109, a high-performance evaluation board designed to demonstrate the benefits of eGaN FETs in a compact, thermally efficient, two-phase synchronous buck converter. Targeting

EPC | 14-07-2025

Mouser Electronics, Inc. now stocks the SRP4021HMCT shielded power inductors from Bourns. The new shielded power inductors satisfy the increasing demand for high current density and inductor reliability in electronic designs. These shielded

Mouser Electronics | 11-07-2025

Renesas Electronics Corporation has introduced the RA8P1 MCU group, targeting AI and ML applications, as well as real-time analytics. The new MCUs set a new performance benchmark for MCUs by combining a 1GHz Arm Cortex-M85 and a 250MHz Cort

Renesas | 11-07-2025

Würth Elektronik and Nexperia have produced the NEVB-MTR1-KIT1 modular motor driver evaluation kit. The kit, created in collaboration, can be configured for use in under two minutes and is conveniently powered via USB-C. Thanks to the open

Wurth | 11-07-2025

TDK Corporation has introduced the TDK-Lambda RGF board-mount EMI filters. Suitable for power supplies with high input current requirements, these 20 and 40A filters are designed to deliver outstanding differential mode filtering. Utilising

TDK | 11-07-2025

Amphenol RF has introduced the SMPM-to-SMPM assembly on RG-178 cable into our extensive and diverse portfolio of cable assemblies. The compact size of these assemblies makes them highly suited for use in applications where space is at a pre

Amphenol | 11-07-2025

LEM has released a new series of DC meters. The introduction of the DCES600 and DCES1500 enables DC charging infrastructure manufacturers to accelerate time-to-market for fast and megawatt charging solutions, with kWh billing services. The

LEM | 10-07-2025

Amphenol RF has expanded its portfolio of extreme exposure solutions with the addition of new N-Type cable mount connector configurations. These N-Type plugs are now available for LMR 195, 200 and 600 cable types, delivering more design fle

Amphenol | 10-07-2025

Timestrip has introduced new electronic time and temperature indicators, expanding its highly flexible and easy-to-use neo family. The new Timestrip neo DF and Timestrip neo DG offer unique flexibility and ease of use for monitoring sensiti

Timestrip | 10-07-2025

As the demand for GaN semiconductors continues to grow, Infineon Technologies AG is poised to capitalise on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market. Today, the company announc

Infineon | 10-07-2025

Mouser Electronics, Inc. now offers the new FCMA62N Wi-Fi 6/Bluetooth 5.3 modules from Quectel. The modules provide an ultra-compact LCC form factor (38.3mm × 21.6mm × 4.75mm), with multiple low-power consumption modes and custom features t

Mouser Electronics | 09-07-2025