AI


New module supports leading RF technologies and AI

Insight SIP is launching the ISP2554-HM module. This module represents a dynamic IoT node, with support for BLE, Thread, and Zigbee radios and high-performance computing including an ability to run AI at the Edge. It can form the core of a

Insight SIP | 18-03-2025

New COM Express compact module offers unrivalled AI performance

congatec boosts AI performance for medical, robotics, industrial, retail, and gaming applications, delivering up to 99 TOPS. This excellent AI performance is driven by the new conga-TC750 COM in the COM Express Compact Type 6 form factor, w

Congatec | 18-03-2025

Powering AI roadmap with cutting-edge BBU for AI data centres

Infineon Technologies AG presents its roadmap for next-level Battery Backup Unit (BBU) solutions for uninterrupted operations of AI data centres to avoid power outages and the risk of data losses. The comprehensive BBU roadmap includes powe

Infineon | 18-03-2025

IoT platforms for generative AI applications unveiled

MediaTek has introduced the high-performance Genio 720 and Genio 520 edge-AI IoT platforms. These new additions to the Genio series support the latest generative AI models, HMI, multimedia, and connectivity features for smart home, retail,

MediaTek | 17-03-2025

Mid-class AI processor extended for smart factories and intelligent cities of tomorrow

Renesas Electronics Corporation has expanded its RZ/V Series of MPUs with a new device that targets the high-volume vision AI market. Similar to its high-end device, the RZ/V2H, the new RZ/V2N MPU comes with the company's proprietary AI acc

Renesas | 17-03-2025

MCU family with integrated high-performance analog peripherals unveiled

To meet the growing demand for high-performance, math-intensive applications in a wide range of industries, Microchip Technology has released the PIC32A family of MCUs. Improving the company’s already robust 32-bit MCU portfolio, the MCUs a

Microchip Technology | 17-03-2025

Innovative memory solutions and design for AI edge applications in new eBook

Mouser Electronics, Inc. has announced it is once again a Platinum sponsor of the 'Create the Future Design Contest'. The contest is a global challenge to engineers and innovators worldwide to design the next great thing for a chance to win

Mouser Electronics | 14-03-2025

Ultra-low-power connectivity triple combo SoC family for embedded edge AI IoT

Synaptics Incorporated has extended its award-winning Veros Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and BLE, and IEEE 802.15.4 (Zigbee/Thread) SoCs. Designed for

Synaptics | 14-03-2025

Next-gen high-density power modules for VPD in AI data centres

Infineon Technologies AG offers the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute. The new OptiMOS TDM2454xx quad-phase power modules enable best-in-class power density a

Infineon | 13-03-2025

Changing the trajectory of the IoT with a new approach to edge AI

Synaptics Incorporated are unveiling a new family of MCUs and a new family of SoCs designed for a wide range of ultra-low-power IoT devices that exhibit contextually-aware AI and ultra-reliable wireless connectivity. For IoT system desig

Synaptics | 11-03-2025

AI partnership to advance computer vision at the edge

Aetina and Axelera AI have partnered to deliver high-performance, power-efficient AI inference solutions for industries, including smart transportation, surveillance, and retail. With growing demand for compact, high-performance AI at th

Aetina | 10-03-2025

Development kit for AI and edge applications now available

Mouser Electronics, Inc. now offers the new Digi ConnectCore MP255 development kit. The ConnectCore MP255 kit boasts a versatile, secure, and cost-effective wireless SOM designed for maximum power efficiency to support battery-powered and i

Mouser Electronics | 07-03-2025

Smartphone series unveiled with pioneering AI thermal imaging

Ulefone has launched the performance powerhouse Armor 28 Ultra Series. Dimensity 9300 plus global debut, 16GB plus 1TB massive storage. Its Thermal Version features next-gen AI-powered thermal imaging. The company launched the Armor 28 Ultr

Ulefone | 04-03-2025

IP enables chip for AI applications to achieve dynamic power saving of greater than 40%

SureCore has enabled KU Leuven to develop a neural processing accelerator chip for AI applications that delivers dynamic power savings of over 40% compared to solutions using the industry standard SRAM. Already demonstrated in more mature n

SureCore | 28-02-2025

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