Following the launch of the industry's first PFC and hybrid flyback (HFB) combo IC, Infineon Technologies AG introduces the E-version of its hybrid flyback controller family. Developed for high-performance applications, the new XDP hybrid f

Infineon | 25-03-2025

Nexperia has introduced a range of highly efficient and robust industrial grade 1200V SiC MOSFETs with industry-leading temperature stability in innovative surface-mount (SMD) top-side cooled packaging technology called X.PAK. This package,

Nexperia | 25-03-2025

To assist engineers in meeting stringent safety requirements while minimising design costs and complexity, Microchip Technology has released the AVR SD family of MCUs. The MCUs feature built-in functional safety mechanisms and are designed

Microchip Technology | 25-03-2025

Nexperia has added 12 new devices to its continuously expanding e-mode GaN FET portfolio. This latest release is intended to meet the growing demand for higher efficiency and more compact systems. The new low and high-voltage e-mode GaN FET

Nexperia | 24-03-2025

Power Integrations has announced TinySwitch-5, extending the output power of the most popular family of integrated off-line switcher ICs to 175W. The new device achieves up to 92% efficiency using basic diode rectification and optocoupler f

Power Integrations | 24-03-2025

Mouser Electronics, Inc. now stocks radiation-hardened LEO A-Grade ICs from Apogee Semiconductor. These ICs include logic devices, level translators, transceivers and more. These devices are fabricated in a 180nm CMOS process using propriet

Mouser Electronics | 21-03-2025

Many industrial applications today are moving towards higher power levels with minimised power losses. One way to accomplish this is to increase the DC link voltage. Infineon Technologies AG satisfies this market trend with the CoolSiC Scho

Infineon | 21-03-2025

onsemi has introduced the first generation of its 1200V SiC MOSFET based SPM 31 IPMs. These IPMs deliver the highest energy efficiency and power density in the smallest form factor compared to utilising Field Stop 7 IGBT technology, resulti

onsemi | 21-03-2025

Silicon Labs has announced its new Series 2 BG29 family of wireless SoCs, developed to bring high compute and connectivity to the smallest form factor BLE devices without compromising performance. The new series is ideal for today's most in

Silicon Labs | 20-03-2025

Texas Instruments has debuted new power-management chips to support modern data centres' rapidly growing power needs. As high-performance computing and AI adoption increases, data centres require more power-dense and efficient solutions. Th

Texas Instruments | 19-03-2025

Würth Elektronik has introduced its new Cordelia-I Wi-Fi module, specifically designed for secure IoT and 'edge computing' applications. This versatile module is excellent for applications in Industry 4.0, Smart City/Smart Home, eMobility,

Wurth | 18-03-2025

Insight SIP is launching the ISP2554-HM module. This module represents a dynamic IoT node, with support for BLE, Thread, and Zigbee radios and high-performance computing including an ability to run AI at the Edge. It can form the core of a

Insight SIP | 18-03-2025

Qorvo has added a highly integrated BLDC motor driver to its increasing family of power management products. Its new 160V, three-phase gate driver allows smaller solution size and dramatically decreases design time and BOM cost/count compar

Qorvo | 17-03-2025

MediaTek has introduced the high-performance Genio 720 and Genio 520 edge-AI IoT platforms. These new additions to the Genio series support the latest generative AI models, HMI, multimedia, and connectivity features for smart home, retail,

MediaTek | 17-03-2025