Toshiba Electronics Europe GmbH has released a small new intelligent power device (IPD) for space-constrained BLDC motor drive applications such as air conditioners, air purifiers, and pumps. The new IPD (TPD4165K) has an increased maxim
Toshiba Electronics | 29-08-2024
Voice coil motors (VCMs) have been essential to smartphone camera assemblies over the last decade, providing features such as image stabilisation and autofocus. DELO offers DELO DUALBOND LT2221 as a universal adhesive for over 50 bonding ta
DELO | 29-08-2024
Bourns, Inc. has released its Riedon UL Class-T and ANL modular fuse blocks. The new devices address the protection requirements in a wide range of applications, including industrial power systems, battery chargers, solar inverters, and bat
Bourns | 29-08-2024
Pasternack has launched its new in-house pre-built gain horn assemblies providing coax adapters and antenna mounts. These assemblies offer enhanced usability and ease of mounting for various applications. The new assemblies use the compa
Pasternack | 29-08-2024
Mouser now stocks Murata's Type 2DK UWB/Bluetooth LE combo module (LBUA2ZZ2DK-882). The Type 2DK module integrates an NXP Trimension SR040 UWB chipset, the NXP QN9090 Bluetooth LE plus MCU chipset, an onboard antenna, and all necessary p
Mouser Electronics | 28-08-2024
Anritsu Corporation will use the upcoming ECOC 2024 to demonstrate solutions to the challenges arising from the rapid growth in global data traffic. Driven by the increased uptake of AI, high-definition video streaming, and autonomous drivi
Anritsu | 28-08-2024
Nexperia has added two new ideal diode ICs to its continuously growing portfolio of power devices. The NID5100 is suitable for standard industrial and consumer applications, while the NID5100-Q100 has been qualified for use in automotive ap
Nexperia | 28-08-2024
Hirose has expanded its one-action FPC connector family to include the smallest version to date. With a pitch of 0.25mm, height of 0.65mm, and thickness of 0.2mm, the FH82 Series FPC connector provides space-savings that reduce the size of
Hirose | 28-08-2024
OMNIVISION has introduced the newest image sensor in its wide mobile product portfolio: the OV50M40. Including advanced technologies for front, main, ultra-wide and telephoto cameras in smartphones, the device is a versatile 0.61µm pixel CM
OMNIVISION | 28-08-2024
PMIC Click, from MIKROE, is a compact add-on board for efficient power management in rechargeable applications. This board offers the nPM1300, an advanced PMIC from Nordic Semiconductor, providing integrated battery charging, fuel gauge, an
Mikroelektronika | 28-08-2024
ABLIC has launched the S-34HTS08AB SPD IC for DDR5 memory modules. The amount of communication data handled by client PCs and data centre servers has been growing rapidly, resulting in the necessity for higher-level data processing capacity
ABLIC | 28-08-2024
Würth Elektronik has released its hybrid WE-EMIP EMI absorber sheet, a convenient solution for preventing EMI. The integrated adhesive layer makes the patch easy to stick on. It provides high attenuation exceeding 40dB over a wide frequency
Wurth | 28-08-2024
HighPoint has unveiled the RocketStor 654x Series, a new line of external NVMe RAID enclosures created to elevate Gen4 Storage applications to new heights by effectively packaging uncompromised x16 transfer performance and nearly ½ petabyte
HighPoint | 27-08-2024
This high-precision, zero-drift operational amplifier from Analog Devices Inc., and now available from WIN SOURCE, represents a considerable advancement in precise monitoring and control within electronic systems, delivering powerful soluti
WIN SOURCE | 27-08-2024
30-06-2025 | In The News | By Matthew Walker
26-06-2025 | In The News | By Robin Mitchell