Industrial


High-density PSU reference design for AI data centres and servers

Infineon Technologies AG has introduced a 12kW reference design for high-performance PSUs, specifically designed for AI data centres and server applications. The reference design offers high efficiency and high-power density, leveraging all

Infineon | 12-09-2025

Partnership delivers fast and flexible NVMe storage expansion solutions

HighPoint Technologies Inc. and ICY DOCK have formed a strategic partnership to deliver a series of high-performance, integration-friendly NVMe storage solutions for workstations, servers, and custom-built computing platforms. Designed t

HighPoint | 12-09-2025

Adhesives validated in miniLED connections pave the way for scalable microLED production

DELO has conducted extensive reliability tests on directional conductive adhesives, confirming their suitability as a robust alternative to solder in miniLED display manufacturing. The recent study focused on the long-term performance of ad

DELO | 12-09-2025

Ultra-slim SMD 5G antenna powers next-generation IoT devices

Leankon has introduced the ultra-slim SMD 5G antenna LK1830101, now available and engineered to meet the evolving demands of next-generation IoT applications. Purpose-built for tracker systems, fleet management, industrial automation, smart

Leankon | 12-09-2025

Pioneering next-generation UCIe-A/S chiplet interconnects for AI systems

Sarcina Technology has revealed the development of patented methodologies for the UCIe-A and UCIe-S protocols. The company's latest innovations include an optimised RDL (redistribution layer) interposer design for die-to-die interconnection

Sarcina Technology | 11-09-2025

Extra space and accessories for wide-format handheld enclosures

Accessories for OKW’s SOFT-CASE wide-format handheld enclosures now comprise intermediate rings that create extra space for components. Tilt foot bars, battery clips, ring and strap eyelets, and belt/wall Combi-Clips are also available.

OKW Enclosures | 11-09-2025

Machine and asset health monitoring market with vibration sensor solutions

TDK Corporation has announced that its subsidiary, Tronics Microsystem, is expanding its product portfolio to include vibration sensor solutions aimed at process and asset monitoring applications. This strategic development represents a maj

TDK | 11-09-2025

Vapour phase reflow system for high-performance PCB assembly

Altus Group now offers the ASSCON VP 2200 vapour phase reflow system, the first dual-lane inline VP unit available in the region. The system addresses the growing demand for high-throughput, thermally challenging PCBAs in military, medical,

Altus Group | 11-09-2025

Simplifying far-infrared temperature sensor selection

Selecting the correct non-contact far-infrared (FIR) temperature sensor can be challenging due to performance and application factors, including the target object's size and distance. Experimental trial and error can be complicated and time

Melexis | 11-09-2025

Solution provides seamless management of software, data and AI across edge and cloud  

aicas has announced the global launch of its new EdgeSuite. The solution is a modular, edge-to-cloud infrastructure designed to unify software, data, and AI model management. With the solution, companies can accelerate development, scale AI

aicas | 11-09-2025

ToF laser sensors achieve stable detection of difficult-to-sense targets

Mouser Electronics, Inc., now offers the new E3AS-HF ToF laser sensors from Omron Industrial Automation. These ToF photoelectric sensors achieve stable, continuous-level detection of difficult-to-sense targets for industrial automation, man

Mouser Electronics | 10-09-2025

Ultra-compact CMOS op amp delivers industry-leading ultra-low circuit current

ROHM’s ultra-compact CMOS op amp – TLR1901GXZ – achieves the industry’s lowest operating circuit current. This IC is optimised to be applied as a measurement sensing amplifier in size-constrained applications such as handheld measurement in

ROHM Semiconductor | 10-09-2025

Innovative solutions for digital optical and virtualisation challenges

Anritsu Corporation will join the upcoming ECOC 2025 in Copenhagen to demonstrate solutions to the challenges arising from the explosive growth in global data traffic. Driven by the unprecedented expansion of AI applications, UHD video stre

Anritsu | 10-09-2025

Innovative payment, telemetry and HMI solutions

SECO will showcase a full range of payment terminals, telemetry solutions, and HMIs for the vending industry at Vendtra. The innovations on display support intuitive and reliable control of vending machines, enabling operators to reduce cos

SECO | 10-09-2025

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