New rapid thermal cycle chamber with 20k/min ramp rate

ESPEC has released a new thermal cycle chamber capable of delivering a controlled specimen temperature ramp rate of 20K/min, developed to satisfy the growing demands of international standards for semiconductor and electronics reliability testing. The TCC-151W-20 is available in the UK through Unitemp.

As semiconductor devices continue to evolve to support applications such as generative AI, autonomous vehicles and high-density data centres, thermal stress testing under extreme conditions has become vital. The device is specifically engineered to support these needs, with a temperature range from -70C to +180C and precise specimen-based ramp control at 15K/min and 20K/min. This enables compliance with key global testing protocols, including JEDEC JESD22-A104, IPC-9701, and the latest revision of IEC 60068-2-14, which now mandates faster, constant-rate thermal cycling for electronic and in-vehicle components.

The chamber includes a cascade refrigeration system that uses R-449A refrigerant, replacing the previously used R-404A. This change decreases the system's global warming potential (GWP) by 64%, from 3920 to 1397, aligning with environmental regulations such as the UK's fluorocarbon management rules.

The internal test volume of the chamber is 160 litres, with internal dimensions measuring 800mm wide x 500mm high x 400mm deep. The unit achieves the 20K/min ramp rate using a 5kg specimen (glass epoxy board) and a 4kg jig, supplying consistent and repeatable test conditions for high-reliability electronics.

The TCC-151W-20 offers manufacturers across various sectors, including automotive, aerospace, and advanced computing, a reliable solution for qualifying electronic components under aggressive thermal cycling conditions. Its introduction reflects the increasing pressure on developers to satisfy ever-stricter qualification requirements while also decreasing environmental impact.