Enclosure concept offers innovative design for wireless, embedded and instrumentation systems

The innovative and advanced BoVersa enclosure concept from BOPLA offers customers a modern design suitable for a wide range of applications. Flexible and customer-specific design options include a lighting concept, wireless communication and maximised cooling technology.

The new enclosure can be used for applications that require handheld, tabletop, wall, or pole mounting. The enclosure provides optimal conditions for instrumentation, security systems, IoT, wireless systems, embedded systems, and more.

For wireless systems, a die-cast aluminium enclosure body with moulded-in cooling fins can be combined with a plastic cover, permitting unhindered radio transmission while supplying an optimal combination for wireless applications that need cooling.

For efficient heat dissipation, the concept has integrated cooling fins into the die-cast aluminium enclosure. The point-symmetrical design of the fins optimises airflow and ensures cooling of the enclosure when mounted horizontally or vertically. The uniform airflow maximises the efficiency of cooling and delivers even and stable temperature distribution in the enclosure, extending the service life and reliability of the built-in electronics.

The unit features a three-part enclosure structure comprising a lower part, a functional lid, and a design cover that can be combined as needed. Colour accents can be added by combining enclosure parts in different colours to suit an application or branding requirement.

Key features of the new BoVersa enclosure system from BOPLA include:

• A transparent function lid providing a view inside the enclosure or built-in displays.
• The enclosure parts can be combined in different colours. The transparent and translucent functional lids can also be used to set lighting design accents.
• Open version for integration with keyboards and displays, or a closed version for a clean look and individual designs.
• The closed design cover can change the appearance of the enclosure almost indefinitely through individual processing. No visible enclosure screws.
• The frame-shaped design cover is perfect for integrating keyboards and displays, while the closed version allows for a clean look or custom designs.
• For applications with special mechanical stability requirements, a cover made of die-cast aluminium is also available - the cover screws are concealed under covers.
  The combination of high protection class and material properties enables use in outdoor areas. Plastic material PC UL 94 V0 is suitable for outdoor use, environmental protection to IP66 / 68 (1.2m - 2h), DIN EN 60529
  A pole attachment is available as an optional accessory.
  Mounting tabs are directly moulded on the aluminium lower part and can be retrofitted separately on the plastic lower part.
  The lower part has a moulded-in receptacle for a pressure equalisation diaphragm that can be 'activated' at the factory.
• The point-symmetrical design of the cooling fins allows for optimal airflow in horizontal and vertical mounting positions.

Equipment designers can create a bespoke enclosure solution by selecting the required components from the wide range of standard options.

The company can offer customers full box-build services, including mechanical processing, printing, Engraving, Lacquer finishing, Full assembly, automated PCB pick and place, Custom colours, and custom design sample services.

"With BoVersa, we are taking into account the growing requirements of users and expanding our portfolio in a targeted manner. We offer a holistic solution for numerous areas that we have developed on the basis of current market requirements," says Andreas Krömer, head of Development at BOPLA.