The Master Bond EP4S-80 is a one-component silver-filled epoxy that meets NASA low outgassing requirements. It offers an unlimited working life at room temperature, and a moderate heat cure need of 80C. With a viscosity of 10,000-15,000cps, it has a smooth flow and is easily brushable, making it excellent for EMI/RFI shielding and static dissipation. This formulation can also be used in various applications where electrical conductivity is required, such as bonding, coating, sealing, and gap-filling and encapsulating.
The epoxy offers excellent mechanical properties with a tensile modulus of 500,000-600,000psi and a 22,000-24,000psi compressive strength at 25C. This electrically conductive system provides a volume resistivity of 0.02-0.06ohm-cm and a thermal conductivity of 1.30-1.44W/(m•K). Upon curing, it provides low shrinkage, superior dimensional stability and a glass transition temperature of 130-135C. This compound is serviceable over the temperature range of -60C to +150C [-75F to +300F] and adheres well to various substrates such as metals, glass, ceramics, composites, and semiconductor materials, and many plastics. It is packaged in ounce and pound jars.