One component epoxy satisfies NASA low outgassing specifications

Master Bond EP17HTND-CCM is a new single component epoxy which is not premixed and frozen. The product is more convenient to handle, apply and store than typical two-component glob

Products | 29-11-2018

Two component epoxy system has excellent thermal shock resistance

Master Bond EP110F8-3 is a two-part epoxy system perfect for sealing, potting, encapsulating, and casting applications. “This toughened system offers very good flexibility and main

Products | 10-09-2018

High tensile strength epoxy adhesive uses renewable biomaterial

Master Bond EP70CN is a two-part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This epoxy system forms high physical strength b

Subs & Systems | 08-08-2018

One part silver conductive epoxy offers ultra-high heat transfer capability

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was created for critical thermal management applications. As a one component system, it is not premixed and frozen and ha

Products | 17-05-2018

Nanosilica filled epoxy meets NASA low outgassing specifications

Master Bond EP30NS is a two-component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear particularly in thin sections and

Products | 03-05-2018

Electrically conductive die attach adhesive has very high thermal conductivity

Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22kg-f and has a high thermal

Products | 01-11-2017

Electrically insulative epoxy delivers low exotherm for large castings and potting applications

Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. “It is a versatile product that combines

Products | 19-07-2017

Rapid curing two component epoxy offers chemical resistance and high bond strength

Master Bond’s EP41S-F is a two-part epoxy for bonding, sealing, coating and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance an

Products | 30-06-2017

Room temperature curing epoxy has low thermal resistance

Formulated for use in demanding thermal management applications, Master Bond’s EP30TC is a two component epoxy that contains a robust thermally conductive filler with very fine par

Products | 01-02-2017

Thermally conductive, high temperature resistant epoxy passes NASA standards

Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries and can be used vac

Products | 14-12-2016

Adhesive, sealant and coating passes NASA low outgassing tests

Well suited for use in vacuum environments, Master Bond MasterSil 973S-LO is an adhesive, sealant and coating that passes NASA low outgassing tests. This electrically conductive, t

Products | 07-10-2016

Two-part nickel conductive epoxy meets NASA low outgassing specifications

Master Bond’s EP21TDCN-LO nickel filler is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation

Products | 24-08-2016

No mix, thermally conductive, electrically insulative epoxy for underfill applications

Master Bond’s EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system

Products | 13-07-2016

One part electrically-conductive epoxy meets NASA specifications

A new single-component epoxy for demanding bonding, sealing and coating applications, EP3HTS-LO has been developed by Master Bond. The system passes ASTM E595 tests for NASA low ou

Products | 11-05-2016