Archive - March 2025

Radiation-hardened LEO A-Grade ICs enable space and medical applications

21-03-2025 | Mouser Electronics | Semiconductors

High-capacity NVMe SSD for AI applications

21-03-2025 | Kioxia | Industrial

Fifth generation of IC family for high-efficiency power supplies launched

24-03-2025 | Power Integrations | Power

Vibration-resistant quarter-turn locks for a wide range of applications

24-03-2025 | Emka | Industrial

GaN FET portfolio supports wide power needs in low/high-voltage applications

24-03-2025 | Nexperia | Power

Complete li-ion battery management platform with pre-validated firmware

24-03-2025 | Renesas | Power

New line of threaded SMPM interconnects released

24-03-2025 | SV Microwave | Industrial

Exploring innovative memory solutions and design for AI edge applications

24-03-2025 | Mouser Electronics | Automotive & Transport

Entry-level MCUs reduce system costs and complexity in safety-critical applications

25-03-2025 | Microchip Technology | Semiconductors

Industry-leading 1200V SiC MOSFETs launched in top-side cooled X.PAK

25-03-2025 | Nexperia | Power

High-temperature relay permits denser board designs

25-03-2025 | Omron | Power

Innovating from the data centre to the edge to unlock the full potential of AI platforms

25-03-2025 | Micron | Industrial

SMPM bullet adapters eliminate magnetic interference and increase performance

25-03-2025 | Amphenol | Industrial

Tactile switch series lifespan extended for high-use applications

25-03-2025 | Littelfuse | Industrial

New hybrid flyback controller ICs for ultra-high power density designs

25-03-2025 | Infineon | Power

High-power cables for use in commercial and defence applications

25-03-2025 | Insulated Wire | Industrial