Archive - August 2015

New chips offer highest inductance and lowest DCR of any 0402-sized RF choke

05-08-2015 | Coilcraft Europe | Passives

World’s first 256Gb 48-layer BiCS FLASH features innovative 3D-stack structure

05-08-2015 | Toshiba | Semiconductors

Proven single-contact IDC connector range now offers PTH terminations

05-08-2015 | AVX | Connectors, Switches & EMECH

Encapsulated AC/DC power supplies for low-power applications

05-08-2015 | Mouser Electronics | Power

Water-repellent monolithic ceramic capacitor suppresses ion migration

05-08-2015 | Murata | Design Applications

LED indicators approved for the most demanding applications

05-08-2015 | Apem | Connectors, Switches & EMECH

Evaluation board for AD9361 wideband transceiver IC in MIMO applications

05-08-2015 | Mouser Electronics | Design & Manufacture

Screened servo cable can replace seven existing cables in one go

05-08-2015 | Farnell element14 | Subs & Systems

Reinforced isolated modulator with LDO regulator and LVDS interface

05-08-2015 | Texas Instruments | Semiconductors

Low-current right-angle LEDs lamps target indicator applications

05-08-2015 | RS Components | Connectors, Switches & EMECH

Mezzanine connectors available in 3mm to 6mm stack heights in 0.5mm increments

05-08-2015 | TTI Europe | Connectors, Switches & EMECH

Power-management IC supports numerous outputs with various current ratings

05-08-2015 | Mouser Electronics | Power

Tiny RF module speeds time-to-market for implantable medical device designers

06-08-2015 | MicroSemi | Subs & Systems

Establish power sequencing patterns in small to large multi-rail power systems

06-08-2015 | Mouser Electronics | Power

World’s first 16-die stacked NAND flash memory with TSV technology

06-08-2015 | Toshiba | New Technologies

Dual 16-bit TxDAC+ permits multicarrier generation up to Nyquist frequency

06-08-2015 | Mouser Electronics | Semiconductors