Industrial


Revolutionising IoT with interactive demonstrations

SECO is appearing at embedded world 2025, featuring Clea, its advanced modular IoT and AI software suite. Through hands-on developer experiences and live demonstrations, attendees will explore its real-time AI, data processing, and industri

SECO | 26-02-2025

Next-gen module for innovative Bluetooth 6 applications

Rutronik is extending its wireless potfolio to include the next-generation PAN B511-1x Bluetooth 6 module from Panasonic. The LE (Low Energy) module is based on the ultra-low-power wireless SoC nRF54L15 from Nordic and combines its most imp

Rutronik | 26-02-2025

AI-powered edge computing innovations unveiling

Aetina is unveiling a robust portfolio of edge AI hardware and software solutions at embedded world 2025, empowering businesses worldwide to unlock new opportunities at the intelligent edge. Leading the lineup is the company's DeviceEdge

Aetina | 26-02-2025

Latest edge AI computing solutions for AIoT released

Cincoze will display world-class industrial embedded computing products around the theme of 'Edge AI, Smart Integration' at embedded world 2025, encompassing the full spectrum of industrial application environments in four dedicated zones,

Cincoze | 26-02-2025

First space-grade GaN FET gate driver helps satellites become smaller and more efficient

Texas Instruments has announced a new family of radiation-hardened and radiation-tolerant half-bridge GaN FET gate drivers. This family of gate drivers incorporates the industry's first space-grade GaN FET driver that supports up to 200V op

Texas Instruments | 25-02-2025

Showcasing the latest products in edge AI

Advantech will show edge AI's power with its latest products at the MECSPE tradeshow. Visitors to the company's booth will have the opportunity to learn how to revolutionise manufacturing operations with cutting-edge AI and embedded computi

Advantech | 25-02-2025

DC-DC converter series with two-sided board coating option for harsh industrial applications

TDK Corporation has introduced two further options to the TDK-Lambda brand CCG series of 1.5W to 10W isolated DC-DC converters. The newly available two-sided board coating supplies extra protection for use in harsh environments, including r

TDK | 25-02-2025

Ultrabright and low power-consumption LED lighting strips for industrial applications

OMC offers a range of ultrabright, low-power-consumption LED lighting strips in polycarbonate housings with a diameter that matches that of T5 fluorescent tubes. These low-voltage LED strips provide energy savings of up to 65% over traditio

OMC | 25-02-2025

SiC full-bridge modules simplify development of solar, energy storage and battery charging

SemiQ Inc. has announced a family of three 1200V SiC full-bridge modules, each incorporating two of the company's rugged high-speed switching SiC MOSFETs with reliable body diode. The modules have been designed to simplify the developmen

SemiQ | 25-02-2025

IDE software adds advanced capabilities

PAC Machine Edition 10.6 Release adds a PLC Simulator and performance improvements to its integrated development environment, improving developer productivity. Emerson has released PAC Machine Edition (PME) 10.6, the integrated developme

Emerson | 25-02-2025

Thinnest and very low ESR prismatic supercapacitors launched

The prismatic supercapacitors from Schurter are super-thin. With a thickness of just 0.4mm, the SCPA is currently the world's thinnest Supercap. Supercaps, also known as supercapacitors, are a special type of energy storage device that c

Schurter | 25-02-2025

Delivering expert perspectives on motor control for EVs in new eBook

Mouser Electronics, Inc. has announced a new eBook in collaboration with NXP Semiconductors, exploring how the electrification of systems, including industrial and automotive, relies heavily on advances and innovation in motor control techn

Mouser Electronics | 24-02-2025

BNC configurations support new cable types for various applications

Amphenol RF expands its BNC connector portfolio with options suited for use with versatile and highly flexible micro-miniature 0.81 mm, 1.32 mm and 1.37 mm cables. Amphenol RF has expanded its BNC product portfolio with extra options fea

Amphenol | 24-02-2025

Transistor in new silicon-footprint packages to drive industry-wide standardisation

GaN technology plays a crucial role in enabling power electronics to reach the highest performance levels. However, GaN suppliers have taken different approaches to package types and sizes, leading to fragmentation and a lack of multiple fo

Infineon | 24-02-2025