New SiC technology delivers smarter and faster solid-state power distribution

Infineon Technologies AG expands its SiC portfolio with the new CoolSiC JFET product family to enable the next generation of solid-state power distribution systems. The new devices deliver minimised conduction losses, solid turn-off capability, and high robustness, making them excellent for advanced solid-state protection and distribution. With robust short-circuit capability, thermal stability in linear mode, and precise overvoltage control, these devices allow reliable and efficient system performance in a wide range of industrial and automotive applications, including SSCBs, AI data centre hot-swaps, eFuses, motor soft starters, industrial safety relays, and automotive battery disconnect switches.

"With CoolSiC JFET, we are addressing the growing demand for smarter, faster, and more robust power distribution systems," says Dr Peter Wawer, division president of Green Industrial Power at Infineon Technologies. "This application-driven power semiconductor technology is specifically designed to provide our customers with the tools they need to solve the complex challenges in this rapidly evolving space. We are proud to introduce devices that achieve best-in-class RDS(ON), setting a new standard for SiC performance and reaffirming Infineon's leadership in the field of wide-bandgap technology."

The first generation of CoolSiC JFETs features ultra-low RDS(ON) starting at 1.5mΩ (750V BDss) and 2.3mΩ (1200V BDss), significantly reducing conduction losses. The bulk-channel optimised SiC JFET provides high robustness under short-circuit and avalanche failure conditions. Housed in a Q-DPAK top-side cooled package, the devices support easy paralleling and scalable current handling, allowing compact, high-power systems with flexible layout and integration options. Their predictable switching behaviour under thermal stress, overload and fault conditions provides maximum long-term reliability in continuous operation.

To meet the thermal and mechanical challenges of harsh application environments, CoolSiC JFETs uses the company's advanced .XT interconnection technology with diffusion soldering. This greatly improves transient thermal impedance and robustness under pulsed and cyclic loads typical of industrial power systems. Tested and qualified under real-world operating conditions of solid-state power switches and based on the industry-standard Q-DPAK package, the devices allow quick and seamless design integration in industrial and automotive applications.