Renesas

Highly integrated PMIC delivers complete power solution to reduce design time

13-08-2021 | Semiconductors

Voice-controlled AI solution combines advanced vision and voice technologies

03-08-2021 | New Technologies

New SoCs offer 20% higher CPU speed for automotive systems

22-07-2021 | Automotive Technologies

Solution for automotive cameras enables high-definition video

15-07-2021 | Automotive Technologies

Modular IoT development platform reduces time-to-market and design complexity

12-07-2021 | Design & Manufacture

Platform delivers ozone detection for wearables and monitoring devices

25-06-2021 | Test & Measurement

MCU families with simple licensing for secure embedded IoT development

18-06-2021 | Semiconductors

Expanded range of smallest photocouplers

04-06-2021 | Lighting Technologies

LTE CAT-M1 module for Massive IoT based on carrier-proven technology

01-06-2021 | Subs & Systems

MPUs with best-in-class power efficiency and high-precision AI accelerator

24-05-2021 | Semiconductors

DDR5 I3C bus extension and SPD hub devices qualified for partner firmware

05-05-2021 | Semiconductors

Expanded timing portfolio for high-performance communications

29-04-2021 | Test & Measurement

First general-purpose MCU to obtain CMVP Level 3 certification

27-04-2021 | Semiconductors

Partners to develop next-generation high-end RISC-V solutions

23-04-2021 | Automotive Technologies