Rutronik has recently added Axelera AI, a European pioneer in AI and edge computing, to its franchise partners. Axelera Metis products provide a compelling alternative to conventional GPU-based solutions, combining high performance, efficie

Rutronik | 19-08-2025

Arrow Electronics has taken a bold step in advancing FPGA innovation with the launch of its latest development platform, the AXE5000 Starter Kit. Marking a global first, this kit features production silicon from the highly anticipated

Arrow | 15-08-2025

Arrow Electronics now offers its new FPGA development platform, the AXE5000 starter kit, featuring the world's first production silicon Altera Agilex 5 FPGA. This release supplies engineers with an opportunity to evaluate and develop design

Arrow | 14-08-2025

Samtec, Inc. provides development and evaluation kits to ensure and validate that its interconnect products fulfil customers' performance needs. This includes mil/aero applications and utilising COTS and open standards products. The comp

Samtec | 11-08-2025

Delivering Ethernet connectivity for embedded systems, XPort ETH Click is a compact add-on board from MIKROE. Two versions are available: the standard module (XE) and the SE board, which adds 256-bit AES encryption support. Both devices are

Mikroelektronika | 29-07-2025

The Chomerics Division of Parker Hannifin Corporation has unveiled a new two-component (2k) dispensable thermal gap filler and CIP material offering 3.5W/m-K thermal conductivity. THERM-A-GAP CIP 35E provides an alternative to hard-curing d

Parker Chomerics | 23-07-2025

Advantech has launched the MIC-3812V2. This 3U CompactPCI Serial peripheral board is engineered to empower mission-critical applications in demanding industries. Designed for outstanding reliability and performance, the board integrates MXM

Advantech | 21-07-2025

Phlux Technology is offering an evaluation board for its Aura family of Noiseless InGaAs avalanche photodiodes (APDs). The APDs are used as 1550nm infrared sensors and claim 12 times greater sensitivity than conventional devices in applicat

Phlux Technology | 15-07-2025

Efficient Power Conversion Corporation (EPC) has released the EPC91109, a high-performance evaluation board designed to demonstrate the benefits of eGaN FETs in a compact, thermally efficient, two-phase synchronous buck converter. Targeting

EPC | 14-07-2025

Würth Elektronik and Nexperia have produced the NEVB-MTR1-KIT1 modular motor driver evaluation kit. The kit, created in collaboration, can be configured for use in under two minutes and is conveniently powered via USB-C. Thanks to the open

Wurth | 11-07-2025

Advantech has introduced the SOM-6820, a COM Express Compact Type 6 module powered by the Qualcomm Snapdragon X-Elite series processors. Featuring up to 12 cores and a 45W TDP, the SOM-6820 delivers up to 65% greater power efficiency at a f

Advantech | 09-07-2025

Available from Powell Electronics are Amphenol's Tri-Start MIL-DTL-38999 Series III / EN3645 thread coupling connectors for general duty and severe environment applications. The devices deliver very high-performance capabilities and support

Powell Electronics | 07-07-2025

FORTEC United Kingdom has introduced the COM-MTHC6, a high-performance COM Express Type 6 Compact module developed to meet the rigorous demands of embedded computing in transportation and defence environments. Combining cutting-edge process

FORTEC United Kingdom | 04-07-2025

Virtium Embedded Artists has launched the iMX8M Mini DX-M1, a SoM which integrates a quad-core application processor and a 25 TOPS AI hardware accelerator chip with associated memory on a board with a compact 82mm x 50mm footprint. By in

Virtium Embedded Artists | 03-07-2025