Boards


Partnership delivers fast and flexible NVMe storage expansion solutions

HighPoint Technologies Inc. and ICY DOCK have formed a strategic partnership to deliver a series of high-performance, integration-friendly NVMe storage solutions for workstations, servers, and custom-built computing platforms. Designed t

HighPoint | 12-09-2025

Vapour phase reflow system for high-performance PCB assembly

Altus Group now offers the ASSCON VP 2200 vapour phase reflow system, the first dual-lane inline VP unit available in the region. The system addresses the growing demand for high-throughput, thermally challenging PCBAs in military, medical,

Altus Group | 11-09-2025

Advanced selective soldering solution boosts manufacturing efficiency

Datalink Electronics has partnered with Altus Group to incorporate a cutting-edge automated soldering solution, improving its production capabilities and reinforcing its strategic focus on quality, automation, and scalability. The partne

Altus Group | 08-09-2025

Click board provides high-quality wireless audio streaming and data comms over Bluetooth

BT Audio 4 Click is a compact add-on board from MIKROE that dramatically cuts development time by providing innovative hardware and software products based on proven standards. Designed to deliver high-quality wireless audio streaming and d

Mikroelektronika | 02-09-2025

Cutting-edge edge AI and robotics-ready embedded solutions

Advantech will present its industry-leading portfolio of high-performance edge computing platforms, robotics-ready systems and advanced embedded boards at Microelectronics 2025. Visitors will see live demonstrations of AI at the edge, along

Advantech | 29-08-2025

Dual-core MCU support added in latest productivity hub

MIKROE has announced that version 7.3.0 of its NECTO Studio IDE now supports dual-core MCUs, enabling designers to program and debug each core independently while flashing merged firmware in the background. This enables tasks to be run in p

Mikroelektronika | 28-08-2025

High-speed Ethernet multifunction analogue I/O module offers advanced features

ACCES I/O Products has announced its newest Ethernet-based data acquisition computer solution – the eNET-AIO16-16F. This standalone, high-speed analogue input/output module delivers reliable, flexible, and high-performance DAQ capability ov

ACCES I/O | 26-08-2025

Early access program for 3U VPX cards featuring next-gen embedded processors and adaptive SoCs

BittWare, a Molex company, has announced an early access program to jumpstart the development and integration of embedded systems employing the company's new 3U VPX cards powered by next-generation AMD Ryzen Embedded processors, AMD Versal

BittWare | 22-08-2025

New standards for AI inference with new accelerators

Rutronik has recently added Axelera AI, a European pioneer in AI and edge computing, to its franchise partners. Axelera Metis products provide a compelling alternative to conventional GPU-based solutions, combining high performance, efficie

Rutronik | 19-08-2025

Agilex 5 FPGA Development Kit by Arrow Released

Arrow Electronics has taken a bold step in advancing FPGA innovation with the launch of its latest development platform, the AXE5000 Starter Kit. Marking a global first, this kit features production silicon from the highly anticipated

Arrow | 15-08-2025

First development kit featuring production silicon Altera Agilex 5 FPGA

Arrow Electronics now offers its new FPGA development platform, the AXE5000 starter kit, featuring the world's first production silicon Altera Agilex 5 FPGA. This release supplies engineers with an opportunity to evaluate and develop design

Arrow | 14-08-2025

Development and evaluation kits for mil/aero applications

Samtec, Inc. provides development and evaluation kits to ensure and validate that its interconnect products fulfil customers' performance needs. This includes mil/aero applications and utilising COTS and open standards products. The comp

Samtec | 11-08-2025

New Click board provides Ethernet connectivity for embedded systems

Delivering Ethernet connectivity for embedded systems, XPort ETH Click is a compact add-on board from MIKROE. Two versions are available: the standard module (XE) and the SE board, which adds 256-bit AES encryption support. Both devices are

Mikroelektronika | 29-07-2025

Two-component thermal gap filler and CIP material simplifies application process

The Chomerics Division of Parker Hannifin Corporation has unveiled a new two-component (2k) dispensable thermal gap filler and CIP material offering 3.5W/m-K thermal conductivity. THERM-A-GAP CIP 35E provides an alternative to hard-curing d

Parker Chomerics | 23-07-2025

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