Vapour phase reflow system for high-performance PCB assembly

Altus Group now offers the ASSCON VP 2200 vapour phase reflow system, the first dual-lane inline VP unit available in the region. The system addresses the growing demand for high-throughput, thermally challenging PCBAs in military, medical, and industrial applications. The system supplies faster reflow processing, greater flexibility, and lower maintenance costs, building on the success of ASSCON's VP 2100, launched in 2021.

The system was developed as a single, flexible system platform to meet customer needs for speed, flexibility, and performance while keeping costs low. Configurable in single-lane or dual-lane mode, and with or without vacuum, it replaces four previous inline systems with one fully retrofittable solution. Upgrade paths and retrofit options ensure the platform can evolve with customer requirements.

Joe Booth, CEO of Altus Group, said: "ASSCON is a prime example of a supplier focused on customer value and long-term horizons. By concentrating on a single process, they are pushing the technology to places it hasn't been before. They are already the leading brand, and this type of investment in research and development will only strengthen their position.

"Vapour phase reflow is highly popular in the UK and Ireland because of the complex, high-technology PCBAs we specialise in, particularly in the military, industrial, and medical sectors, all of which have seen strong growth recently. For some applications and volumes, higher throughput is crucial, and the ability to use the VP 2200 in dual-lane mode, effectively doubling what was previously possible, will have a major positive impact. I can't wait to see the unit again at Productronica, where ASSCON will officially launch the new platform."

In dual-lane mode, the system accepts boards from single-lane upstream production and employs a modular shuttle to double throughput, making it the first dual-lane vapour phase unit on the market. Maintenance is simplified, with consistent spare parts, easily accessible components, and reduced service effort.

The system features its permanent filter system, which reduces GALDEN filter change time by 90%. The filters are positioned inside the cooling zone without a housing, and the simplified design maintains full effectiveness while halving the number of parts. Flux management has also been improved to improve operational uptime. The software platform and HMI provide a consistent, intuitive operating and programming experience across batch and inline systems.

Tobias Tuffentsammer, head of sales at ASSCON, added: "We believe that innovation is key to staying at the forefront of the vapour phase process and, more broadly, to capturing a larger share of the overall reflow market. We have been listening to our customers and know they are very satisfied with vapour phase technology, but many face pressures to handle high volumes, which demands shorter reflow tact times.

"This new platform will be revolutionary for the throughput capacity we can offer customers, while also simplifying our internal processes and providing numerous advantages for both ASSCON and our clients. Thanks to economies of scale, we can deliver this level of innovation at a competitive price point, further enhancing customer ROI."