Advanced R&D flip-chip bonder launched for multiple markets

22-11-2022 | SET | Industrial

SET Corporation has officially launched the FC150 PLATINUM for the automotive, defence, telecom, quantum, HPC, AI, and VR markets. This new equipment is the latest version of the bonder, which can be seen in laboratories all over the world.

The machine includes all the company's features and 40 years of know-how. The accuracy of the previous version has been positively improved thanks to ± 0.1µm alignment accuracy. And the parallelism between the two samples is adjusted within just a few microradians.

The machine provides manual (step-by-step) and automatic modes. It is designed for chip-to-chip (up to 100mm) and chip-to-wafer (up to 200mm) applications on the same open platform. Its many features cover many applications from low to high forces of 0.25-2000N.


By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.